MHSL02525 Selling Leads, Price trend, MHSL02525 DataSheet download, circuit diagram from SeekIC.com

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SeekIC No. : 003444868 Detail

MHSL02525: HEATSINK 2.28L X.225"H EXTRUSION

MHSL02525 Data Sheet

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Part Number:: MHSL02525
Mfg:
Supply Ability:: 5000

Price Break

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1~5000

Unit Price
Negotiable

Processing time
15 Days

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Upload time: 2024/10/30

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Recent History
What is this?

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Product Details

Quick Details

Capacitance :	16.5 pF	Series:	-
Manufacturer:	GE Energy	Type:	Board Level
Package Cooled:	-	Attachment Method:	Bolt On
Shape:	Rectangular	Length:	2.280" (57.91mm)
Width:	1.450" (36.83mm)	Diameter:	-
Height Off Base (Height of Fin):	0.225" (5.71mm)	Power Dissipation @ Temperature Rise:	-
Thermal Resistance @ Forced Air Flow:	-	Thermal Resistance @ Natural:	-
Material:	Aluminum

Description

Type: Board Level
Attachment Method: Bolt On
Diameter: -
Power Dissipation @ Temperature Rise: -
Material: Aluminum
Material Finish: Black Anodized
Series: -
Shape: Rectangular
Thermal Resistance @ Forced Air Flow: -
Thermal Resistance @ Natural: -
Package Cooled: -
Length: 2.280" (57.91mm)
Width: 1.450" (36.83mm)
Manufacturer: GE Energy
Height Off Base (Height of Fin): 0.225" (5.71mm)

Parameters:

Technical/Catalog Information	MHSL02525
Vendor	Lineage Power
Category	Thermal Management
Attachment Method	Bolt On
Height	0.225" (5.715mm)
Material	Aluminum
Package Cooled	-
Power Dissipation @ Temperature Rise	-
Thermal Resistance @ Forced Air Flow	-
Outline	57.91mm x 36.83mm
Thermal Resistance @ Natural	-
Lead Free Status	Lead Free
RoHS Status	RoHS Compliant
Other Names	MHSL02525 MHSL02525

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MHSL02525

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