MH8V7245BWZTJ -6

Features:

·Utilizes industry standard 8M x 8 RAMs in TSOP and industry standard EEPROM in TSSOP
·168-pin (84-pin dual dual in-line package)
·Single +3.3V(±0.3V) supply operation
·Low stand-by power dissipation
         16.2mW(Max) . . . . . . . . . . . . . . . . . . . LVCMOS input level
·Low operation power dissipation
              MH8V7245BWZTJ -5 . . . . . . . . . . . . . . . . . . 4.22W(Max)
              MH8V7245BWZTJ -6 . . . . . . . . . . . . . . . . . . 3.89W(Max)
·All input are directly LVTTL compatible
·All output are three-state and directly LVTTL compatible
·Includes(0.22uF x 9) decoupling capacitors
·4096 refresh cycle every 64ms
·Hyper-page mode,Read-modify-write,
    /CAS before /RAS refresh,Hidden refresh capabilities
·Gold plating contact pads


Application

Main memory unit for computers , Microcomputer memory


Specifications

Symbol	Parameter	Conditions	Ratings	Unit
Vcc	Supply voltage	With respect to Vss	-0.5~ 4.6	V
IO	Output current		50	mA
Pd	Power dissipation	Ta=25°C	9	W
Topr	Operating temperature		0~70	°C
Tstg	Storage temperature		-40~125	°C

Description

The MH8V7245BWZTJ is 8388608-word x 72-bit dynamic ram module. This consist of nine industry standard 8M x 8 dynamic RAMs in TSOP and one industry standard EEPROM in TSSOP.

The mounting of TSOPs and TSSOP MH8V7245BWZTJ on a card edge dual in-line package provides any application where high densities and large of quantities memory are required.

MH8V7245BWZTJ is a socket-type memory module ,suitable for easy interchange or addition of module.