MH4V724AWXJ -6

Features:

·Utilizes industry standard 4M x 16 RAMs in SOJ and industry standard 4M x 4 RAMs in SOJ and industry standard      EEPROM in TSSOP
·168-pin (84-pin dual dual in-line package)
·Single +3.3V(±0.3V) supply operation
·Low stand-by power dissipation
      10.8mW(Max) . . . . . . . . . . . . . . . . . . . LVCMOS input level
·Low operation power dissipation
              MH4V724AWXJ -5 . . . . . . . . . . . . . . . . . . 2.82W(Max)
              MH4V724AWXJ -6 . . . . . . . . . . . . . . . . . . 2.53W(Max)
·All input are directly LVTTL compatible
·All output are three-state and directly LVTTL compatible
·Includes(0.22uF x 8) decoupling capacitors
·4096 refresh cycle every 64ms
·Fast-page mode,Read-modify-write,
   /CAS before /RAS refresh,Hidden refresh capabilities
·JEDEC standard pin configuration and SPD
·Gold plating contact pads


Application

Main memory unit for computers , Microcomputer memory


Specifications

Symbol	Parameter	Conditions	Ratings	Unit
Vcc	Supply voltage	With respect to Vss	-0.5~4.6	V
VI	Input voltage		-0.5~4.6	V
VO	Output voltage		-0.5~4.6	V
IO	Output current		50	mA
Pd	Power dissipation	Ta=25°C	6	W
Topr	Operating temperature		0~ 70	°C
Tstg	Storage temperature		-40~ 125	°C

Description

The MH4V724AWXJ is 4194304-word x 72-bit dynamic ram module. This consist of four industry standard 4M x
16 dynamic RAMs in SOJ and two industry standard 4Mx 4 dynamic RAMs in SOJ and one industry EEPROM in TSSOP.

The mounting of SOJs and TSSOP MH4V724AWXJ on a card edge dual in-line package provides any application where high densities and large of quantities memory are required.

MH4V724AWXJ is a socket-type memory module ,suitable for easy interchange or addition of module.