Features: ·Utilizes industry standard 4M X 4 DRAMs in TSOP package and 4M X 1 DRAMs in TSOP package·Single 5V ± 10%supply·Low stand-by power dissipation 66mW (Max) . . . . . . . . . . . . . . . . . . . CMOS lnput level·Low operating power dissipation MH4M36CJD - 5 . . . . . . . . . . . . . . . . ....
MH4M36CJD-6: Features: ·Utilizes industry standard 4M X 4 DRAMs in TSOP package and 4M X 1 DRAMs in TSOP package·Single 5V ± 10%supply·Low stand-by power dissipation 66mW (Max) . . . . . . . . . . . . . . . . . ...
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Features: `72pin single in-line package`Single 5.0V ± 10% supply`Low stand-by power dissipation 44...
Features: `72pin single in-line package`Single 5.0V ± 10% supply`Low stand-by power dissipation 44...
Features: `72pin single in-line package`Single 5.0V ± 10% supply`Low stand-by power dissipation 44...
Symbol | Parameter | Conditions | Ratings | Unit |
Vcc | Supply voltage | With respect to Vss | -1 ~ 7 | V |
VI | Input voltage | -1 ~ 7 | V | |
VO | Output voltage | -1 ~ 7 | V | |
IO | Output current | 50 | mA | |
Pd | Power dissipation | Ta=25°C | 12 | W |
Topr | Operating temperature | 0~ 70 | °C | |
Tstg | Storage temperature | -40~ 125 | °C |