MH32S72APHB -6

Features:

·Utilizes industry standard 16M x 8 Sy nchronous DRAMs TSOP and industry standard EEPROM in TSSOP
·168-pin (84-pin dual in-line package)
·single 3.3V±0.3V power supply
·Max. Clock frequency -6:133MHz,-7,8:100MHz
·Fully synchronous operation referenced to clock rising edge
·4 bank operation controlled by BA0,1(Bank Address)
·/CAS latency- 2/3(programmable)
·Burst length- 1/2/4/8/Full Page(programmable)
·Burst type- sequential / interleave(programmable)
·Column access - random
·Auto precharge / All bank precharge controlled by A10
·Auto refresh and Self refresh
·4096 refresh cycle /64ms
·LVTTL Interface
·Discrete IC and module design conform to PC100/PC133 specification.


Application

PC main memory


Specifications

Symbol	Parameter	Condition	Ratings	Unit
Vdd	Supply Voltage	with respect to Vss	-0.5 ~ 4.6	V
VI	Input Voltage	with respect to Vss	-0.5 ~ Vdd+0.5	V
VO	Output Voltage	with respect to Vss	-0.5 ~ Vdd+0.5	V
IO	Output Current		50	mA
Pd	Power Dissipation	Ta=25°C	18	W
Topr	Operating Temperature		0 ~ 70	°C
Tstg	Storage Temperature		-40 ~ 100	°C

Description

The MH32S72APHB is 33554432 - word by 72-bit Synchronous DRAM module. This consists of eighteen industry standard 16Mx8 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP.

The mounting of TSOP MH32S72APHB on a card edge Dual Inline package provides any application where high densities and large quantities of memory are required.

MH32S72APHB is a socket type - memory modules, suitable for easy interchange or addition of modules.