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MH32S64APFB -8

Features: ·Utilizes industry standard 16M x 8 Sy nchronous DRAMs Small TSOP and industry standard EEPROM in TSSOP·144-pin (72-pin dual in-line package)·single 3.3V±0.3V power supply·Clock frequency 100MHz(max.)·Fully synchronous operation referenced to clock rising edge·4 bank operation controlled...

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SeekIC No. : 004420123 Detail

MH32S64APFB -8: Features: ·Utilizes industry standard 16M x 8 Sy nchronous DRAMs Small TSOP and industry standard EEPROM in TSSOP·144-pin (72-pin dual in-line package)·single 3.3V±0.3V power supply·Clock frequency ...

MH32S64APFB -8 Data Sheet

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Part Number:
MH32S64APFB -8
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/26

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Product Details

Description



Features:

·Utilizes industry standard 16M x 8 Sy nchronous DRAMs Small TSOP and industry standard EEPROM in TSSOP
·144-pin (72-pin dual in-line package)
·single 3.3V±0.3V power supply
·Clock frequency 100MHz(max.)
·Fully synchronous operation referenced to clock rising edge
·4 bank operation controlled by BA0,1(Bank Address)
·/CAS latency- 2/3(programmable)
·Burst length- 1/2/4/8/Full Page(programmable)
·Burst type- sequential / interleave(programmable)
·Column access - random
·Auto precharge / All bank precharge controlled by A10
·Auto refresh and Self refresh
·4096 refresh cycle /64ms
·LVTTL Interface


Application

main memory or graphic memory in computer systems


Specifications

Symbol Parameter Condition Ratings Unit
Vdd Supply Voltage with respect to Vss -0.5 ~ 4.6 V
VI Input Voltage with respect to Vss -0.5 ~ Vdd+0.5 V
VO Output Voltage with respect to Vss -0.5 ~ Vdd+0.5 V
IO Output Current   50 mA
Pd Power Dissipation Ta=25°C 16 W
Topr Operating Temperature   0 ~ 70 °C
Tstg Storage Temperature   -40 ~ 100 °C



Description

The MH32S64APFB is 33554432 - word by 64-bit Synchronous DRAM module. This consists of sixteen industry standard 16Mx8 Synchronous DRAMs in Small TSOP and one industory standard EEPROM in TSSOP.

The mounting of Small TSOP MH32S64APFB on a card edge Dual Inline package provides any application where high densities and large quantities of memory are required.

MH32S64APFB is a socket type - memory modules, suitable for easy interchange or addition of modules.




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