Features: Utilizes industry standard 16M x 4 RAMs TSOP and industry standard input buffer in TSSOP 168-pin (84-pin dual in-line package) Single +3.3V(±0.3V) supply operation Low stand-by power dissipation . . . . . . . . 68.4mW(Max) Low operation power dissipation MH16V72TJ -6 . . . . . . . . . ....
MH16V72TJ-7: Features: Utilizes industry standard 16M x 4 RAMs TSOP and industry standard input buffer in TSSOP 168-pin (84-pin dual in-line package) Single +3.3V(±0.3V) supply operation Low stand-by power diss...
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Symbol |
Parameter |
Conditions |
Ratings |
Unit |
Vcc |
Supply voltage | With respect to Vss |
-0.5~4.6 |
V |
VI |
Input voltage |
-0.5~Vcc+0.5 | ||
VO |
Output voltage |
-0.5~Vcc+0.5 | ||
IO | Output current |
50 |
mA | |
Pd | Power dissipation | Ta=25°C |
20 |
W |
Topr | Operating temperature |
0~70 |
°C | |
Tstg | Storage temperature |
-40~100 |
°C |
The MH16V72TJ is 16777216-word x 72-bit dynamic ram module. This consist of eighteen industry standard 16M x 4 dynamic RAMs in TSOP and two industry standard input buffer in TSSOP.
The mounting of MH16V72TJ on a card edge dual in-line package provides any application where high densities and large of quantities memory are required.
MH16V72TJ is a socket-type memory module ,suitable for easy interchange or addition of module.