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MH16S72BDFA-7

Features: ·Utilizes industry standard 16M X 4 Synchronous DRAMs in TSOP package , industry standard Resistered buffer in TSSOP·package and industry standard PLL in TSSOP package·3.3V +/- 0.3V supply·LVTTL Interface·Burst length 1/2/4/8/Full Page(programmable)·Burst Write / Single Write(programmabl...

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SeekIC No. : 004420059 Detail

MH16S72BDFA-7: Features: ·Utilizes industry standard 16M X 4 Synchronous DRAMs in TSOP package , industry standard Resistered buffer in TSSOP·package and industry standard PLL in TSSOP package·3.3V +/- 0.3V supply...

MH16S72BDFA-7 Data Sheet

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Part Number:
MH16S72BDFA-7
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/26

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Product Details

Description



Features:

·Utilizes industry standard 16M X 4 Synchronous DRAMs in TSOP package , industry standard Resistered buffer in TSSOP
·package and industry standard PLL in TSSOP package
·3.3V +/- 0.3V supply
·LVTTL Interface
·Burst length 1/2/4/8/Full Page(programmable)
·Burst Write / Single Write(programmable)
·precharge / All bank precharge controlled by A10
·Auto refresh and Self refresh
·4096 refresh cycles every 64ms


Application

Main memory unit for computers, Microcomputer memory.


Specifications

Symbol Parameter Condition Ratings Unit
Vdd Supply Voltage with respect to Vss -0.5 ~ 4.6 V
VI Input Voltage with respect to Vss -0.5 ~ 4.6 V
VO Output Voltage with respect to Vss -0.5 ~ 4.6 V
IO Output Current   50 mA
Pd Power Dissipation Ta=25°C 20.7 W
Topr Operating Temperature   0 ~ 70
Tstg Storage Temperature   -45 ~ 100



Description

The MH16S72BDFA is 16777216 - word x 72-bit Sy nchronous DRAM module. This consist of eighteen industry standard 16M x 4 Sy nchronous DRAMs in TSOP.

The TSOP on a card edge dual in-line package of MH16S72BDFA prov ides any application where high densities and large of quantities memory are required.

MH16S72BDFA is a socket-ty pe memory module ,suitable f or easy interchange or addition of module.




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