Features: Frequency CLK Access Time(Component SDRAM) -7,-7L 100MHz 6.0ns(CL=2) -8,-8L 100MHz 6.0ns(CL=3) PC100 compliant·Utilizes industry standard 8M x 16 Sy nchronous DRAMsTSOP and industry standard EEPROM in TSSOP·single 3.3V±0.3V power supply·144-pin (72-pin dual in-line ...
MH16S64APFC-7: Features: Frequency CLK Access Time(Component SDRAM) -7,-7L 100MHz 6.0ns(CL=2) -8,-8L 100MHz 6.0ns(CL=3) PC100 compliant·Utilizes industry standard 8M x 16 Sy nchronous DRAMsTS...
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Frequency | CLK Access Time (Component SDRAM) | |
-7,-7L | 100MHz | 6.0ns(CL=2) |
-8,-8L | 100MHz | 6.0ns(CL=3) |
PC100 compliant
·Utilizes industry standard 8M x 16 Sy nchronous DRAMs
TSOP and industry standard EEPROM in TSSOP
·single 3.3V±0.3V power supply
·144-pin (72-pin dual in-line package)
·Clock frequency 100MHz(max.)
·Fully synchronous operation referenced to clock rising edge
·4 bank operation controlled by BA0,1(Bank Address)
·Burst length- 1/2/4/8/Full Page(programmable)
·/CAS latency- 2/3(programmable)
·Burst type- sequential / interleave(programmable)
·Column access - random
·Auto precharge / All bank precharge controlled by A10
·Auto refresh and Self refresh
4096 refresh cycle /64ms
·LVTTL Interface
Symbol | Parameter | Condition | Ratings | Unit |
Vdd | Supply Voltage | with respect to Vss | -0.5 ~ 4.6 | V |
VI | Input Voltage | with respect to Vss | -0.5 ~ Vdd+0.5 | V |
VO | Output Voltage | with respect to Vss | -0.5 ~ Vdd+0.5 | V |
IO | Output Current | 50 | mA | |
Pd | Power Dissipation | Ta=25°C | 8 | W |
Topr | Operating Temperature | 0 ~ 70 | °C | |
Tstg | Storage Temperature | -40 ~ 100 | °C |
The MH16S64APFC is 16777216 - word by 64-bit Synchronous DRAM module. This consists of eight industry standard 8Mx16 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP.
The mounting of TSOP on a card edge Dual Inline package of MH16S64APFC provides any application where high densities and large quantities of memory are required.
MH16S64APFC is a socket type - memory modules, suitable for easy interchange or addition of modules.