Features: • 28Vdc input compliant with MIL-STD-704 D/E• Low profile : 0,33 (8.5mm)• Nominal power of 10 W without derating• Wide temperature range : -40°C/+105°C case• High efficiency up to 83 %• Soft start• Galvanic isolation 1.500 VDC• Integrated...
MGDM-10: Features: • 28Vdc input compliant with MIL-STD-704 D/E• Low profile : 0,33 (8.5mm)• Nominal power of 10 W without derating• Wide temperature range : -40°C/+105°C case•...
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The MGDM-10 series is a full family of high performance DC/DC low profile power modules designed for aerospace, military and high-end industrial applications.
These modules use a high frequency fixed switching technic at 480 KHz providing excellent reliability, low noise characteristics, high power density and a low profile package. Standard models are available with nominal input voltages as 5, 12 or 28 volts in range of 4,5-5,5 9-36 or 16- 40 volts. The series include single bi and triple output voltage choices of 3,3, 5, 12, 15, +/-5, +/ -12, +/-15 or +/-24 volts. No external heatsink is required for the MGDM-10 series to supply 10W output power over the case temperature range of -40°C up to 105°C.
All the MGDM-10 modules are designed with LC network filters to minimize reflected input current ripple and output voltage ripple.
The MGDM-10 modules include a soft-start, an input undervoltage lock-out, a permanent short circuit protection and an output overvoltage protection to ensure efficient module protections.
The soft-start allows current limitation and eliminates inrush current during start-up. The short circuit protection completely protects the module against short-circuits of any duration by a shutdown and restores to normal when the overload is removed. The design of MGDM-10 has been carried out with surface mount components and is manufactured in a fully automated process to guarantee high quality. Each module is tested and burned in with a GAIA Converter automated test equipment before and after encapsulation.The modules are potted with an excellent thermal conductive compound and packaged in a metallic case to ensure the module's integrity under high temperature conditions.