MF38M1-L6DAGXX

Features: ·Uses TSOP (Thin Small Outline Package) to achieve very high memory density coupled with high reliability, without enlarging card size.·One to 16 memory ICs can be mounted in a card that is only 5.0mm thick.·Electrostatic discharge protection to 15kV·Buffered interface·Write protect swit...

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SeekIC No. : 004419369 Detail

MF38M1-L6DAGXX: Features: ·Uses TSOP (Thin Small Outline Package) to achieve very high memory density coupled with high reliability, without enlarging card size.·One to 16 memory ICs can be mounted in a card that i...

floor Price/Ceiling Price

Part Number:
MF38M1-L6DAGXX
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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268 Transactions

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Upload time: 2024/11/26

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Product Details

Description



Features:

·Uses TSOP (Thin Small Outline Package) to achieve very high memory density coupled with high reliability, without enlarging card size.
·One to 16 memory ICs can be mounted in a card that is only 5.0mm thick.
·Electrostatic discharge protection to 15kV
·Buffered interface
·Write protect switch
·Attribute memory
·68pin JEIDA/PCMCIA




Application

·Office automation
·Industrial
·Data Communication
·Telecommunications
·Computers nConsumer



Specifications

Symbol
Parameter
Conditions
Ratings
Unit
VCC Supply voltage
With respect to GND
-0.3~6.0
V
Vi Input voltage
-0.3~VCC+0.3
V
Vo Output voltage
0~VCC
V
Topr1 Operating temperature 1
Read, Write, Operation
LC series 0~70
°C
Topr2 Operating temperature 2
Data retention
LC series 0~70
°C
Tstg Storage temperature
-30~80
°C



Description

Mitsubishi's Static RAM cards provide large memory capacities on a device approximately the size of a credit card (85.6mm´54mm´5.0mm). The MF38M1-L6DAGXX cards use an 8/16 bit data bus. Availabale in 8MB capacities, Mitsubishi's SRAM cards conform to the JEIDA/PCMCIA standard. Mitsubishi acheived high density memory, while maintaining credit size by using a thin small outline packaging technology(TSOP). The MF38M1-L6DAGXX TSOP surpasses conventional memory card chip-on-board packaging technology where larger, surface-mount devices result in a tradeoff between card size and optimum memory density. This allows up to 16 memory Ics (plus interface circuitry) to be mounted in a card that in only 5.0mm thick.




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