MF32M1-LYCATXX

Features: ·Uses TSOP (Thin Small Outline Package) to achieve very high memory density coupled with high reliability, without enlarging card size·Electrostatic discharge protection to 15kV·Buffered interface·Write protect switch·68pinApplication·Office automation ·Data Communication·Computers·Indus...

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MF32M1-LYCATXX Picture
SeekIC No. : 004419345 Detail

MF32M1-LYCATXX: Features: ·Uses TSOP (Thin Small Outline Package) to achieve very high memory density coupled with high reliability, without enlarging card size·Electrostatic discharge protection to 15kV·Buffered i...

floor Price/Ceiling Price

Part Number:
MF32M1-LYCATXX
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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268 Transactions

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Upload time: 2024/11/26

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Product Details

Description



Features:

·Uses TSOP (Thin Small Outline Package) to achieve very high memory density coupled with high reliability, without enlarging card size
·Electrostatic discharge protection to 15kV
·Buffered interface
·Write protect switch
·68pin




Application

·Office automation
·Data Communication
·Computers
·Industrial
·Telecommunications
·Consumer




Specifications

Symbol
Parameter
Conditions
Ratings
Unit
Vcc
Supply voltage
With respect to GND
-0.3~6.0
V
V I
Input voltage
-0.3~Vcc+0.3
V
VO
Output voltage
0~Vcc
V
Topr1
Operating temperature 1
Read, Write Operation
0~60
°C
Topr2
Operating temperature 2
Data retention
0~60
°C
Tstg
Storage temperature
Excludes data retention
-20~70
°C



Description

Mitsubishi's Static RAM cards provide large memory capacities on a device approximately the size of a credit card (85.6mm´54mm´3.3mm). The MF32M1-LYCATXX cards use a 8/16 bit data-bus. Available in 64KB, 128KB, 256KB, 512KB, 1 MB, 2 MB and 4 MB capacities, Mitsubishi's SRAM cards conform to the PC Card Standard. Mitsubishi achieved high density memory, while maintaining credit size by using a thin small outline packaging technology (TSOP). The MF32M1-LYCATXX TSOP surpasses conventional memory card chip-on-board packaging technology where larger, surface-mount devices result in a tradeoff between card size and optimum memory density. The TSOP, with external leads spaced on 20-mil centers, is over four times smaller than standard equivalent pin count surface-mount packages. This allows up to 8 memory ICs (plus interface circuitry) to be mounted in a card that in only 3.3mm thick.




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