Features: ·Uses TSOP (Thin Small Outline Package) to achieve very high memory density coupled with high reliability, without enlarging card size·Electrostatic discharge protectiton to 15kV·Buffered interface·68-pin connector·8-bit and 16-bit data width·Write protect switch·Battery voltage pin·LS T...
MF3257-LSDATXX: Features: ·Uses TSOP (Thin Small Outline Package) to achieve very high memory density coupled with high reliability, without enlarging card size·Electrostatic discharge protectiton to 15kV·Buffered ...
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Features: ·Uses TSOP (Thin Small Outline Package) to achieve very high memory density coupled with...
Features: ·Uses TSOP (Thin Small Outline Package) to achieve very high memory density coupled with...
Features: ·Uses TSOP (Thin Small Outline Package) to achieve very high memory density coupled with...
·Uses TSOP (Thin Small Outline Package) to achieve very high memory density coupled with high reliability, without enlarging card size
·Electrostatic discharge protectiton to 15kV
·Buffered interface
·68-pin connector
·8-bit and 16-bit data width
·Write protect switch
·Battery voltage pin
·LS Type Wide Range operating temperature Ta= -20 to 70°C
Symbol |
Parameter |
Conditions |
Ratings |
Unit |
Vcc |
Supply voltage |
With respect to GND |
-0.3~6.0 |
V |
V I |
Input voltage |
-0.3~Vcc+0.3 |
V | |
VO |
Output voltage |
0~Vcc |
°C | |
Topr1 |
Operating temperature 1 |
Read, Write Operation |
LC series 0~70 |
°C |
LS series -20~70 | ||||
Topr2 |
Operating temperature 2 |
Data retention |
LC series 0~70 |
°C |
LS series -20~70 | ||||
Tstg |
Storage temperature |
|
-30~80 |
°C |