Features: ·Uses TSOP (Thin Small Outline Package) to achieve very high memory density coupled with high reliability, without enlarging card size·Electrostatic discharge protection to 15kV·Buffered interface·Write protect switch·68pinApplication·Office automation ·Data Communication·Computers·Indus...
MF3129-LYCATXX: Features: ·Uses TSOP (Thin Small Outline Package) to achieve very high memory density coupled with high reliability, without enlarging card size·Electrostatic discharge protection to 15kV·Buffered i...
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Features: ·Uses TSOP (Thin Small Outline Package) to achieve very high memory density coupled with...
Features: ·Uses TSOP (Thin Small Outline Package) to achieve very high memory density coupled with...
Features: ·Uses TSOP (Thin Small Outline Package) to achieve very high memory density coupled with...
·Uses TSOP (Thin Small Outline Package) to achieve very high memory density coupled with high reliability, without enlarging card size
·Electrostatic discharge protection to 15kV
·Buffered interface
·Write protect switch
·68pin
·Office automation
·Data Communication
·Computers
·Industrial
·Telecommunications
·Consumer
Symbol |
Parameter |
Conditions |
Ratings |
Unit |
Vcc |
Supply voltage |
With respect to GND |
-0.3~6.0 |
V |
V I |
Input voltage |
-0.3~Vcc+0.3 |
V | |
VO |
Output voltage |
0~Vcc |
V | |
Topr1 |
Operating temperature 1 |
Read, Write Operation |
0~60 |
°C |
Topr2 |
Operating temperature 2 |
Data retention |
0~60 |
°C |
Tstg |
Storage temperature |
Excludes data retention |
-20~70 |
°C |
Mitsubishi's Static RAM cards provide large memory capacities on a device approximately the size of a credit card (85.6mm´54mm´3.3mm). The MF3129-LYCATXX cards use a 8/16 bit data-bus. Available in 64KB, 128KB, 256KB, 512KB, 1 MB, 2 MB and 4 MB capacities, Mitsubishi's SRAM cards conform to the PC Card Standard. Mitsubishi achieved high density memory, while maintaining credit size by using a thin small outline packaging technology (TSOP). The MF3129-LYCATXX TSOP surpasses conventional memory card chip-on-board packaging technology where larger, surface-mount devices result in a tradeoff between card size and optimum memory density. The TSOP, with external leads spaced on 20-mil centers, is over four times smaller than standard equivalent pin count surface-mount packages. This allows up to 8 memory ICs (plus interface circuitry) to be mounted in a card that in only 3.3mm thick.