MCR106-2

Specifications Parameter Symbol Value Unit Peak Repetitive Forward and Reverse Blocking Voltage(1)(TJ = 110°C, RGK = 1 kW)MCR106-2MCR106-3MCR106-4MCR106-6MCR106-8 VDRMVRRM 60100200400600 Volts RMS Forward Current(All Conduction Angles) IT(RMS) 4 A A...

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SeekIC No. : 004418675 Detail

MCR106-2: Specifications Parameter Symbol Value Unit Peak Repetitive Forward and Reverse Blocking Voltage(1)(TJ = 110°C, RGK = 1 kW)MCR106-2MCR106-3MCR106-4MCR106-6MCR106-8 VDRMVRRM ...

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Part Number:
MCR106-2
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/26

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Product Details

Description



Specifications

Parameter
Symbol
Value
Unit
Peak Repetitive Forward and Reverse Blocking Voltage(1)
(TJ = 110°C, RGK = 1 kW)
MCR106-2
MCR106-3
MCR106-4
MCR106-6
MCR106-8
VDRM
VRRM
60
100
200
400
600
Volts
RMS Forward Current
(All Conduction Angles)
IT(RMS)
4
A
Average Forward Current
TC = 93°C
TA = 30°C or
I T(AV)
2.55
A
Peak Non-repetitive Surge Current
(1/2 Cycle, 60 Hz, TJ = 40 to +110°C)
ITSM
25
A2sec
Circuit Fusing Considerations
(t = 8.3 ms)
I2t
2.6
Watts
Forward Average Gate Power
(t = 8.3 ms, TC = 80°C)
PG(AV)
0.5
Watts
Forward Peak Gate Current
(Pulse Width 1.0 s, TC = 80°C)
IGM
0.1
A

 Peak Forward Gate Current

 IGM

 0.2

 Watt

 Peak Reverse Gate Voltage

 VRGM

 6

 A

Operating Junction Temperature Range
TJ
40 to +110
°C
Storage Temperature Range
Tstg
40 to +150
°C

 Mounting Torque(2)

 -

 6

 in. lb.

1. VDRM and VRRM for all types can be applied on a continuous basis. Ratings apply for zero or negative gate voltage; however, positive gate voltage shall not be applied concurrent with negative potential on the anode. Blocking voltages shall not be tested with a constant current source such that the voltage ratings of the devices are xceeded.
2. Torque rating applies with use of compression washer (B52200-F006 or equivalent). Mounting torque in excess of 6 in. lb. does not appreciably lower case-to-sink thermal resistance. Anode lead and heatsink contact pad are common. (See AN209B). For soldering purposes (either terminal connection or device mounting), soldering temperatures shall not exceed +200°C. For optimum results, an activated flux (oxide removing) is recommended.




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