Features: · International standard package· Direct copper bonded Al2O3-ceramic with copper base plate· Planar passivated chips· Isolation voltage 3600 V~· UL registered E 72873· Keyed gate/cathode twin pinsApplication· Motor control, softstarter· Power converter· Heat and temperature control for i...
MCD 225: Features: · International standard package· Direct copper bonded Al2O3-ceramic with copper base plate· Planar passivated chips· Isolation voltage 3600 V~· UL registered E 72873· Keyed gate/cathode t...
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