Features: · International standard package, JEDEC TO-240 AA· Direct copper bonded Al2O3 -ceramic base plate· Planar passivated chips· Isolation voltage 3600 V~· UL registered, E 72873· Gate-cathode twin pins for version 1BApplication· DC motor control· Softstart AC motor controller· Light, heat an...
MCC 19: Features: · International standard package, JEDEC TO-240 AA· Direct copper bonded Al2O3 -ceramic base plate· Planar passivated chips· Isolation voltage 3600 V~· UL registered, E 72873· Gate-cathode ...
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· International standard package, JEDEC TO-240 AA
· Direct copper bonded Al2O3 -ceramic base plate
· Planar passivated chips
· Isolation voltage 3600 V~
· UL registered, E 72873
· Gate-cathode twin pins for version 1B
ITRMS |
TVJ = TVJM |
40 25 18 |
A A A | |
ITSM |
TVJ = 45°C; VR = 0 |
t = 10 ms (50 Hz), sine t = 8.3 ms (60 Hz), sine |
400 420 |
A A |
TVJ = TVJM VR = 0 |
t = 10 ms (50 Hz), sine t = 8.3 ms (60 Hz), sine |
350 370 |
A A | |
i2dt |
TVJ = 45°C VR = 0 |
t = 10 ms (50 Hz), sine t = 8.3 ms (60 Hz), sine |
800 730 |
A2s A2s |
TVJ = TVJM VR = 0 |
t = 10 ms (50 Hz), sine t = 8.3 ms (60 Hz), sine |
600 570 |
A2s A2s | |
(di/dt)cr |
TVJ = TVJM f =50 Hz, tP =200 s VD = 2/3 VDRM IG = 0.45 A diG/dt = 0.45 A/s |
repetitive, IT = 45 A |
150 |
A/s |
non repetitive, IT = ITAVM |
500 |
A/s | ||
(dv/dt)cr |
TVJ = TVJM; RGK = ; method 1 |
VDR = 2/3 VDRM (linear voltage rise) |
1000 |
V/s |
PGM |
TVJ = TVJM IT = ITAVM |
tP = 30 s tP = 300 s |
10 5 0.5 |
W W W |
VRGM |
10 |
V | ||
TVJ TVJM Tstg |
-40...+125 125 -40...+125 |
°C °C °C | ||
VISOL |
50/60 Hz, RMS IISOL 1 mA |
t = 1 min |
3000 3600 |
V~ V~ |
Md Weight |
Mounting torque (M5) Terminal connection torque (M5) Typical including screws |
2.5-4.0/22-35 2.5-4.0/22-35 90 |
Nm/lb.in. Nm/lb.in. g |