MC74HC03A

Features: The MC74HC03A is identical in pinout to the LS03. The device inputs are compatible with Standard CMOS outputs; with pullup resistors, they are compatible with LSTTL outputs. The HC03A NAND gate has, as its outputs, a high¤CperformancMOS N¤CChannel transistor. This NAND gate can, therefo...

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SeekIC No. : 004416863 Detail

MC74HC03A: Features: The MC74HC03A is identical in pinout to the LS03. The device inputs are compatible with Standard CMOS outputs; with pullup resistors, they are compatible with LSTTL outputs. The HC03A NAN...

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Part Number:
MC74HC03A
Supply Ability:
5000

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  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/27

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Product Details

Description



Features:

The MC74HC03A is identical in pinout to the LS03. The device inputs are compatible with Standard CMOS outputs; with pullup resistors, they are compatible with LSTTL outputs.


The HC03A NAND gate has, as its outputs, a high¤CperformancMOS N¤CChannel transistor. This NAND gate can, therefore, with  suitable pullup resistor, be used in wired¤CAND applications. Havin the output characteristic curves given in this data sheet, this device can be used as an LED driver or in any other application that only requires a sinking current.

    Output Drive Capability: 10 LSTTL Loads With Suitable Pullu Resistor
    Outputs Directly Interface to CMOS, NMOS and TTL
    High Noise Immunity Characteristic of CMOS Devices
    Operating Voltage Range: 2 to 6V
    Low Input Current: 1A
    In Compliance With the JEDEC Standard No. 7A Requirements
    Chip Complexity: 28 FETs or 7 Equivalent Gates




Pinout

  Connection Diagram


Specifications

Symbol Parameter Value Unit
VCC DC Supply Voltage (Referenced to GND) -0.5 to + 7.0 V
Vin DC Input Voltage (Referenced to GND) -0.5toCC to + 0.5 V
Vout DC Output Voltage (Referenced to GND) -0.5toCC to + 0.5 V
Lin DC Input Current, per Pin ±20 mA
lout DC Output Current, per Pin ±25 mA
ICC DC Supply Current, V and GND Pins ±50 mA
PD

Power Dissipation in Still Air, Plastic DIP+
SOIC Package+
TSSOP Package+

750

500

450

mVV
Tstg Storage Temperature - 65 to + 150
TL

Lead Temperature, 1 mm from Case for 10 Seconds

Plastic DIP, SOIC or TSSOP Package

260



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