PinoutSpecifications Symbol Parameter Value Unit VCC DC Supply Voltage (Referenced to GND) 0.5 to + 7.0 V Vin DC Input Voltage (Referenced to GND) 0.5 to VCC + 0.5 V Vout DC Output Voltage (Referenced to GND) 0.5 to VCC + 0.5 V Iin DC Input Current, per Pin ±20 m...
MC54HC597A: PinoutSpecifications Symbol Parameter Value Unit VCC DC Supply Voltage (Referenced to GND) 0.5 to + 7.0 V Vin DC Input Voltage (Referenced to GND) 0.5 to VCC + 0.5 V Vout D...
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PinoutDescriptionThe F373 contains eight D-type latches with 3-state output buffers. When the Latc...
PinoutDescriptionThe F374 consists of eight edge-triggered flip-flops with individual D-type input...
Symbol | Parameter | Value | Unit |
VCC | DC Supply Voltage (Referenced to GND) | 0.5 to + 7.0 | V |
Vin | DC Input Voltage (Referenced to GND) | 0.5 to VCC + 0.5 | V |
Vout | DC Output Voltage (Referenced to GND) | 0.5 to VCC + 0.5 | V |
Iin | DC Input Current, per Pin | ±20 | mA |
Iout | DC Output Current, per Pin | ±25 | mA |
ICC | DC Supply Current, VCC and GND Pins | ±50 | mA |
PD | Power Dissipation in Still Air,Plastic DIP† SOIC Package† TSSOP Package† |
750 500 450 |
mW |
Tstg | Storage Temperature | 65 to + 150 | C |
TL | Lead Temperature, 1 mm from Case for 10 Seconds (Plastic DIP, SOIC or TSSOP Package) (Ceramic DIP) |
260 300 |
C |