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MC34280FTB

Features: • Low Input Voltage, 1V up• Low Quiescent Current in Standby Mode: 35mA typical• PFM and Synchronous Rectification to ensure high efficiency (87% @200mA Load)• Adjustable Main Output: nominal 3.3V @ 200mA max, with 1.8V input• Auxiliary Output Voltage can be...

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MC34280FTB: Features: • Low Input Voltage, 1V up• Low Quiescent Current in Standby Mode: 35mA typical• PFM and Synchronous Rectification to ensure high efficiency (87% @200mA Load)• Adju...

MC34280FTB Data Sheet

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Part Number:
MC34280FTB
Supply Ability:
5000

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  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/27

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Product Details

Description



Features:

• Low Input Voltage, 1V up
• Low Quiescent Current in Standby Mode: 35mA typical
• PFM and Synchronous Rectification to ensure high efficiency (87% @200mA Load)
• Adjustable Main Output: nominal 3.3V @ 200mA max, with 1.8V input
• Auxiliary Output Voltage can be digitally controlled by microprocessor
• Auxiliary Output Voltage:
   +5V @ 25mA max, with 1.8V input
   +25V @ 15mA max, with 1.8V input
• Current Limit Protection
• PowerON Reset Signal with Programmable Delay
• Battery Low Detection
• Lithium Battery Backup
• 32Pin LQFP Package




Application

• Digital Organizer and Dictionary
• Personal Digital Assistance (PDA)
• Dual Output Power Supply (For MPU, Logic, Memory, LCD)
• Handheld Battery Powered Device (12 AA/AAA cell)




Pinout

Connection Diagram


Specifications

Symbol Parameter Value Unit
vcc DC Supply Voltage (Referenced to GND) 0.5 to +7.0 V
VIN DC Input Voltage (Referenced to GND) 0.5 to VCC + 0.5 V
VOUT DC Output Voltage (Referenced to GND) 0.5 to VCC + 0.5 V
LIN DC Input Current, per Pin ±20 mA
IOUT DC Onput Current, per Pin ±25 mA
ICC DC Supply Current Per Supply Pin ±50 mA
PD Power dissipation in still air piastic DIP
SOIC package
750
500		 mW
TSTG Storage Temperature 65 to +150 °C
TL Lead Temperature, 1 mm from Case for 10 Seconds
(Plastic DIP or SOIC Package)		 260 °C
* Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
?Derating - Plastic DIP: 10 mW/ from 65to 125
Ceramic DIP: 10 mW/ from 100 to 125
SOIC Package: 7 mW/ from 65 to 125
For high frequency or heavy load considerations, see Chapter 2 of the Motorola HighSpeed CMOS Data Book (DL129/D).


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