MC33941

Notes
1. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance. In accordance with SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
2. Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method (MILSPEC 883 Method 1012.1) with the cold plate temperature used for the case temperature.
3. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface of the board near the package.
4. Terminal soldering temperature limit is for 10 seconds maximum duration. The device is not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device.

The MC33941 is intended for cost-sensitive applications where non-contact sensing of objects is desired. When connected to external electrodes, an electric field is created. The MC33941 detects objects in this electric field. The IC generates a low-frequency sine wave, which is adjustable by using an external resistor and is optimized for 120 kHz. The sine wave has very low harmonic content to reduce harmonic interference. The MC33941 also contains support circuits for a microcontroller unit (MCU) to allow the construction of a two-chip E-field system.