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MC33790

Features: ·Two Independent DSI Compatible Buses·Pinout Matched to MC68HC55 (SPI to DSI Logic)·Wave-Shaped Bus Output Voltage·Independent Thermal Shutdown and Current Limit·Return Signalling Current Detection·Internal Logic Input Pull ups and Pull downs·On-Board Charge Pump·2.0 kV ESD Capability·Co...

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SeekIC No. : 004415805 Detail

MC33790: Features: ·Two Independent DSI Compatible Buses·Pinout Matched to MC68HC55 (SPI to DSI Logic)·Wave-Shaped Bus Output Voltage·Independent Thermal Shutdown and Current Limit·Return Signalling Current ...

MC33790 Data Sheet

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Part Number:
MC33790
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

·Two Independent DSI Compatible Buses
·Pinout Matched to MC68HC55 (SPI to DSI Logic)
·Wave-Shaped Bus Output Voltage
·Independent Thermal Shutdown and Current Limit
·Return Signalling Current Detection
·Internal Logic Input Pull ups and Pull downs
·On-Board Charge Pump
·2.0 kV ESD Capability
·Communications Rate Up to 150 kbps
·Pb-Free Packaging Designated by Suffix Code EG




Pinout

Connection Diagram




Specifications

Ratings
Symbol
Value
Unit
Supply Voltage
Continuous
Load Dump - t< 300 ms

VSUP
VSUP(t)

-0.5 to 25
40
V
Maximum Voltage on Input/Output Pins
VDD
DSIxS, DSIxF(1)
DSIxO(1)
-0.3 to 5.5
-0.3 to VDD + 0.3
-0.3 to VSUP + 0.3
V
Storage Temperature
Operating Ambient Temperature
Operating Junction Temperature
Peak Package Reflow Temperature During Reflow (2),(3)
TSTG
TA
TJ
TPPRT
-55 to 150
-40 to 85
-40 to 150
Note 3



Continuous Current per Pin
VDD
DSIxR
VSUP
0 to 10
-2.5 to 5.0
500
mA
Thermal Resistance Junction to Ambient
Thermal Shutdown
RJA
TSD
45
155 to 190
/W
ESD Voltage (All Pins)(4)
Human Body Model
Machine Model
VESD1
VESD2
±2000
±200
V

Notes
1.R =0
2.Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device.
3. Freescale's Package Reflow capability eets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow Temperature and Moisture Sensitivity Levels (MSL),Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.
4. ESD1 performed in accordance with the Human Body Model (CZAP= 100pF, RZAP= 1500 ), ESD2 performed in accordance with theMachine Model (CZAP= 200 pF, RZAP= 0).




Description

The 33790 is a dual channel physical layer interface IC for the Distributed System Interface (DSI) bus. 33790 is designed to meetcan also be used in non automotive automotive requirements. Itapplications. It supports bidirectional communication between slaveand master ICs. Some slave devices derive a regulated 5.0V from the bus, which can be used to power sensors, thereby eliminating theneed for additional circuitry and wiring.






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