MC33290D

Series: -
Mounting Type: Surface Mount
Interface: Serial
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Applications: Automotive
Manufacturer: Freescale Semiconductor
Voltage - Supply: 8 V ~ 18 V
Supplier Device Package: 8-SOICN


Features:

•Operates Over Wide Supply Voltage of 8.0 to 18 V
•Operating Temperature of -40 to 125°C
•Interfaces Directly to Standard CMOS Microprocessors
•ISO K Line Pin Protected Against Shorts to Ground
•Thermal Shutdown with Hysteresis
•ISO K Line Pin Capable of High Currents
•ISO K Line Can Be Driven with up to 10 nF of Parasitic Capacitance
•8.0 kV ESD Protection Attainable with Few Additional Components
•Standby Mode: No VBat Current Drain with VDD at 5.0 V
•Low Current Drain During Operation with VDD at 5.0 V
•Pb-Free Packaging Designated by Suffix Code EF


Pinout




Specifications

 

Rating	Symbol	Value	Unit
VDD DC Supply Voltage	VDD	-0.3 to 7.0	V
VBB Load Dump Peak Voltage	VBB(LD)	45	V
ISO Pin Load Dump Peak Voltage (2)	VISO	40	V
ISO Short Circuit Current Limit	ISO(LIM)	1.0	A
ESD Voltage (3) Human Body Model (4) Machine Model (4)	VESD1 VESD2	±2000 ±200	V
ISO Clamp Energy (5)	Eclamp	10	mJ
Storage Temperature	Tstg	-55 to +150	°C
Operating Case Temperature	TC	-40 to +125	°C
Operating Junction Temperature	TJ	-40 to +150	°C
Power Dissipation TA = 25°C	PD	0.8	W
Peak Package Reflow Temperature During Reflow (6), (7)	TPPRT	Note 7.	°C
Thermal Resistance Junction-to-Ambient	RJA	150	°C/W

Notes
2.Device will survive double battery jump start conditions in typical applications for 10 minutes duration, but is not guaranteed to remain within specified parametric limits during this duration.
3.ESD data available upon request.
4.ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 ), ESD2 testing is performed in accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 ).
5.Nonrepetitive clamping capability at 25°C.
6.Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device.
7.Freescale's Package Reflow capability meets Pb-free requirements for JEDEC standerd J-STD-020C. For Peak Package Reflow Temperature and Moisture Sensitivity Levels (MSL),
> Go to www.freescale.com
> Search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx)]
> Locate your Part Number and in the Details column, select "View"
> Select "Environmental and Compliance Information"


Description

The 33290 is a serial link bus interface device designed to provide bi-directional half-duplex communication interfacing in automotive diagnostic applications. It is designed to interface between the vehicle's on-board microcontroller and systems off-board the vehicle via the special ISO K line. The 33290 is designed to meet the Diagnostic Systems ISO9141 specification. The device's K line bus driver's output is fully protected against bus shorts and overtemperature conditions.

The 33290 derives its robustness to temperature and voltage extremes by being built on a SMARTMOS process, incorporating CMOS logic, bipolar/MOS analog circuitry, and DMOS power FETs. Although the 33290 was principally designed for automotive applications, it is suited for other serial communication applications. It is parametrically specified over an ambient temperature range of

-40ºC TA 125ºC and 8.0 V VBB 18 V supply. The economical SO-8 surface-mount plastic package makes the 33290 very cost effective.