MC33076

The MC33076 dual operational amplifier is available in the standard 8pin plastic dualinline (DIP) and surface mount packages, and also in a 16pin batwing power package. To enhance the power dissipation capability of the power package, Pins 4, 5, 12, and 13 are tied together on the leadframe, giving it an ambient thermal resistance of 52/W typically, in still air. The junctiontoambient thermal resistance (R_qJA) can be decreased further by using a copper padb on the printed circuit board (as shown in Figure 26) to draw the heat away from the package. Care must be taken not to exceed the maximum junction temperature or damage to the device may occur.

The MC33076 operational amplifier employs bipolar technology with innovative high performance concepts for audio and industrial applications. MC33076 uses high frequency PNP input transistors to improve frequency response. In addition, the amplifier provides high output current drive capability while minimizing the drain current. The all NPN output stage exhibits no deadband crossover distortion, large output voltage swing, excellent phase and gain margins, low open loop high frequency output impedance and symmetrical source and sink AC frequency performance.

The MC33076 is tested over the automotive temperature range and is available in an 8pin SOIC package (D suffix) and in both the standard 8 pin DIP and 16pin DIP packages for high power applications.