MBF110

The Fujitsu MBF110 Solid-State Fingerprint Sensor is a direct contact, fingerprint acquisition device. It is a high performance, low power, low cost, capacitive sensor with an integrated twodimensional array of metal electrodes in the sensing array. Each metal electrode acts as one plate of a capacitor and the contacting finger acts as the second plate. A passivation layer on the device surface forms the dielectric between these two plates. Ridges and valleys on the finger yield varying capacitor values across the array, which is read to form an image of the fingerprint.

The MBF110 is manufactured in standard CMOS technology and is available in an 80-pin, VSPA 80/1 and LQFP 80/1. The 300 * 300 sensor array has a 50 m pitch and yields a 500-dpi image. The sensor surface is protected by a patented, ultra-hard, abrasion and chemical resistant coating.

A block diagram of the MBF110 is shown in Figure 1. The MBF110 has an integrated 8-bit flash analog-to-digital converter to digitize the output of the sensor array. The fingerprint image is transmitted on an 8-bit bi-directional bus interface compatible with most microprocessors.

For SETCUR resistor differences between the MBF110 see the Pin Information table.