DescriptionThe MAX9742 operates from a 20V to 40V single supply or a ±10V to ±20V dual supply. The MAX9742 is available in a thermally efficient 36-pin TQFN (6mm x 6mm x 0.8mm)package and is specified over the -40°C to +85°C extended temperature range. The MAX9742 stereo Class D audio power amplif...
MAX9742: DescriptionThe MAX9742 operates from a 20V to 40V single supply or a ±10V to ±20V dual supply. The MAX9742 is available in a thermally efficient 36-pin TQFN (6mm x 6mm x 0.8mm)package and is specifi...
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High Speed Operational Amplifiers Op Amp Comparator Reference IC
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Operational Amplifiers - Op Amps Op Amp Comparator Reference IC
The MAX9742 operates from a 20V to 40V single supply or a ±10V to ±20V dual supply. The MAX9742 is available in a thermally efficient 36-pin TQFN (6mm x 6mm x 0.8mm)package and is specified over the -40°C to +85°C extended temperature range. The MAX9742 stereo Class D audio power amplifier delivers up to 2 x 16W into 4loads. The MAX9742 features high-power efficiency (92% with 8loads), eliminating the need for a bulky heatsink and conserving power. Short-circuit and thermaloverload protection prevent the device from being damaged during a fault condition. Features include fully differential inputs, comprehensive clickand-pop suppression, low-power shutdown mode, and an externally adjustable gain.
The features of MAX9742 can be summarized as (1)2 x 16W output power (RL = 4, THD+N = 10%); (2)high efficiency: up to 92% with RL = 8; (3)mute and shutdown modes; (4)differential inputs suppress common-mode noise; (5)adjustable gain; (6)integrated click-and-pop suppression; (7)low 0.06% THD+N at 3.5W, RL = 8; (8)output short-circuit and thermal protection; (9)available in space-saving, 6mm x 6mm, 36-pin TQFN package.
The absolute maximum ratings of MAX9742 are (1)VDD to VSS, NSENSE: -0.3V to +45V; (2)MID, LGND, LVDD, REGM, REGP, OUTR, OUTL to VSS: -0.3V to +45V; (3)MID, LGND, LVDD, REGM, REGP, OUTR, OUTL to VDD: -45V to +0.3V; (4)REGL to VSS: -0.3V to +12V; (5)MID to REGP, REGM: (VREGM - 0.3V)to (VREGP + 0.3V); (6)REGP to REGM: -0.3V to +12V; (7)LVDD to LGND: -0.3V to +6V; (8)SHDN to LGND: -0.3V to +4V; (9)SFT to LGND: -0.3V to +6V; (10)FB_, IN_+, IN_-, REFCUR to REGP, REGM: (VREGM - 0.3V)to (VREGP + 0.3V); (11)BOOTR to OUTR: -0.3V to +12V; (12)BOOTL to OUTL: -0.3V to +12V; (13)OUTR, OUTL shorted to LGND: continuous; (14)continuous power dissipation (TA = +70°C)single-layer board: 36-pin TQFN (derate 26.3mW/°C above +70°C): 2.11W / multilayer board: 36-pin TQFN (derate 35.7mW/°C above +70°C): 2.86W; (15)junction-to-ambient thermal resistance (JA)single-layer board: 36-Pin TQFN: 38°C/W / multilayer board: 36-pin TQFN: 28°C/W; (16)junction-to-case thermal resistance (JC): 1.4°C/W; (17)operating temperature range: -40°C to +85°C; (18)maximum junction temperature: +150°C; (19)storage temperature range: -65°C to +150°C; (20)lead temperature (soldering, 10s): +300°C.