MAX97001

The MAX97001 operates over the extended -40NC to +85NC temperature range, and is available in the 2mm x 2.5mm, 20-bump, WLP package (0.5mm pitch). The MAX97001 mono audio subsystem combines a mono speaker amplifier with a stereo headphone amplifier and an analog DPST switch. The headphone and speaker amplifiers have independent volume control and on/off control. This allows high gain for low-level signals without compromising the quality of large signals. The 4 inputs are configurable as 2 differential inputs or 4 single-ended inputs. The entire subsystem of MAX97001 is designed for maximum efficiency. The high-efficiency, 700mW, Class D speaker amplifier operates directly from the battery and consumes no more than 1FA in shutdown mode. The Class H headphone amplifier utilizes a dual-mode charge pump to maximize efficiency while outputting a groundreferenced signal that does not require output coupling capacitors. The speaker amplifier MAX97001 incorporates a distortion limiter to automatically reduce the volume level when excessive clipping occurs. All control is performed using the 2-wire I2C interface.

The features of MAX97001 can be summarized as (1)2.7V to 5.5V speaker supply voltage; (2)1.6V to 2V headphone supply voltage; (3)700mW speaker output (VPVDD = 3.7V, ZSPK = 8 + 68H); (4)37mW/channel headphone output (RHP = 16I); (5)low-emission class D amplifier; (6)efficient class H headphone amplifier; (7)ground-referenced headphone outputs; (8)2 stereo single-ended/mono differential inputs; (9)integrated distortion limiter (speaker outputs); (10)integrated DPST analog switch; (11)no clicks and pops; (12)TDMA noise free; (13)2mm x 2.5mm, 20-bump, 0.5mm pitch WLP package.

The absolute maximum ratings of MAX97001 are (1)VDD, HPVDD: -0.3V to +2.2V; (2)PVDD: -0.3V to +6.0V; (3)HPVSS: -2.2V to +0.3V; (4)C1N: (HPVSS - 0.3V)to (HPVDD + 0.3V); (5)C1P: -0.3V to (HPVDD + 0.3V); (6)HPL, HPR: (HPVSS - 0.3V)to (HPVDD + 0.3V); (7)INA1, INA2, INB1, INB2, BIAS: -0.3V to +6.0V; (8)SDA, SCL: -0.3V to +6.0V; (9)COM1, COM2, OUTP, OUTN: -0.3V to (PVDD + 0.3V); (10)continuous current in/out of PVDD, GND, OUT_: ±800mA; (11)continuous current In/out of HPR, HPL, VDD: ±140mA; (12)continuous current in/out of COM1, COM2: ±150mA; (13)continuous input current (all other pins): ±20mA; (14)duration of OUT_ short circuit to GND or PVDD: continuous; (15)duration of short circuit between OUTP and OUTN: continuous; (16)duration of HP_ short circuit to GND or VDD: continuous; (17)continuous power dissipation (TA = +70NC)20-bump WLP multilayer board (derate 13mW/NC above +70NC): 1040mW; (18)junction temperature: +150°C; (19)operating temperature range: -40°C to +85°C; (20)storage temperature range: -65°C to +150°C; (21)soldering temperature (reflow): +260°C.