Features: ` Six Regulators in One Package
Step-Down DC-DC for I/O at 1.3A
Step-Down DC-DC for Memory at 0.9A
Step-Down Serial-Programmed DC-DC for CORE
Up to 0.5A
Three LDO Outputs for SRAM, PLL, and USIM
Always-On Output for VCC_BATT
` Low Operating Current
60A in Sleep Mode (Sleep LDOs On)
130A with DC-DCs On (Core Off)
200A All Regulators On, No Load
5A Shutdown Current
` Optimized for X-Scale Processors
` Backup-Battery Input
` 1MHz PWM Switching Allows Small External
Components
` Tiny 6mm x 6mm, 48-Pin Thin QFN PackageApplication·PDA, Palmtop, and Wireless Handhelds
·Third-Generation Smart Cell Phones
·Internet Appliances and Web-BooksPinout
SpecificationsIN, IN45, IN6, MR, LBO, DBO, RSO, POK, SCL, SDA,
BKBT, V7, SLP, SRAD, PWM3 to GND.........................-0.3V to +6V
REF, CC_, ON_, FB_, DBI, LBI, V1, V2, RAMP, BYP,
MR to GND .....................................................-0.3V to (VIN + 0.3V)
PV1, PV2, PV3, SLPIN to IN......................................-0.3V to +0.3V
V4, V5 to GND ...............................................-0.3V to (VIN45 + 0.3V)
V6 to GND .....................................................-0.3V to (VIN6 + 0.3V)
PV1 to PG1 ...............................................................-0.3V to +6.0V
PV2 to PG2 ...............................................................-0.3V to +6.0V
PV3 to PG3 ...............................................................-0.3V to +6.0V
LX1 Continuous Current.........................................-1.30A to +1.30A
LX2 Continuous Current.............................................-0.9A to +0.9A
LX3 Continuous Current.............................................-0.5A to +0.5A
PG1, PG2, PG3 to GND.................................................-0.3V to +0.3V
V1, V2, V4, V5, V6 Output Short-Circuit Duration............Continuous
Continuous Power Dissipation (TA = +70°C)
6mm x 6mm 48-Pin Thin QFN
(derate 26.3mW/°C above +70°C)................................2105mW
Operating Temperature Range .............................-40°C to +85°C
Junction Temperature.........................................................+150°C
Storage Temperature Range ..............................-65°C to +150°C
Lead Temperature (soldering, 10s) ....................................+300°CDescriptionThe MAX8588 power-management IC is optimized for devices using Intel X-Scale™ microprocessors, including smartphones, PDAs, internet appliances, and other portable devices requiring substantial computing and multimedia capability at low power.
The IC MAX8588 integrates seven high-performance, low-operatingcurrent power supplies along with supervisory and management functions. Included are three step-down DC-DC outputs, three linear regulators, and a seventh always-on output. DC-DC converters power I/O, memory, and the CPU core. The I/O supply of MAX8588 can be preset to 3.3V or adjusted to other values. The DRAM supply is preset for 3.3V or 2.5V, or it can be adjusted with external resistors. The CPU core supply of MAX8588 is serial programmed for dynamic voltage management and can supply up to 0.5A. Linear-regulated outputs are provided for SRAM, PLL, and USIM supplies.
To minimize quiescent current, critical power supplies have bypass "sleep" LDOs that can be activated when output current is very low. Other functions of MAX8588 include separate on/off control for all DC-DC converters, low-battery and dead-battery detection, a reset and power-OK output, a backup-battery input, and a two-wire serial interface.
All DC-DC outputs of MAX8588 use fast, 1MHz PWM switching and small external components. They operate with fixed-frequency PWM control and automatically switch from PWM to skip-mode operation at light loads to reduce operating current and extend battery life. The core output of MAX8588 can be forced into PWM mode at all loads to minimize noise. A 2.6V to 5.5V input voltage range allows 1-cell lithium-ion (Li+), 3-cell NiMH, or a regulated 5V input. The MAX8588 is available in a tiny 6mm x 6mm, 48-pin thin QFN package.
MAX8588 Data Sheet
