MAX6023EBT

Specifications

Item	Rating
(Voltages Referenced to GND)
IN	-0.3V to +13.5V
OUT	-0.3V to (VIN + 0.3V)
Output Short Circuit to GND or IN (VIN < 6V)	Continuous
Output Short Circuit to GND or IN (VIN = 6V)	60s
Operating Temperature Range	-40°C to +85°C
Storage Temperature Range	-65°C to +150°C
Bump Temperature (soldering, 10s)	+300°C
Continuous Power Dissipation
5-Bump UCSP	273mW
Derates above +70°C
5-Bump UCSP	2.4mW/°C

Description

The MAX6023EBT is a family of low-dropout, micropower voltage references in a 5-bump, chip-scale package (UCSP™).The MAX6023 series-mode (three-terminal) references, which operate with input voltages from 2.5V to 12.6V (1.25V and 2.048V options) or (VOUT + 0.2V) to 12.6V (all other voltage options), are available with output voltage options of 1.25V, 2.048V, 2.5V, 3.0V, 4.096V, 4.5V, and 5.0V. The MAX6023EBT is guaranteed an initial accuracy of ±0.2% and/°C temperature drift over the -40°C to +85°C extended temperature range.

The MAX6023EBT offer the benefit of moving to smaller footprint and lower profile devices, significantly smaller than even SC70 or SOT23 plastic surface-mount packages. The significantly lower profile (compared to plastic SMD packages) of the UCSP makes the MAX6023EBT ideal for height-critical applications. Miniature UCSP packages also enable device placement close to sources and allow more flexibility in a complex or large design layout.

The MAX6023EBT voltage references use only 27A of supply current. And unlike shunt-mode (two-terminal) references,the supply current of the MAX6023EBT varies only 0.8A/V with supply-voltage changes, translating to longer battery life. Additionally, these internally compensated devices do not require an external compensation capacitor and are stable up to 2.2nF of load capacitance. The low-dropout voltage and the low supply current make these devices ideal for battery-operated systems.