MAX6023

Features: 5-Bump UCSP Package (1.0mm ✕ 1.5mm ✕ 0.3mm)No Output Capacitor Needed±0.2% (max) Initial Accuracy30ppm/°C (max) Temperature Coefficient35A (max) Quiescent Supply Current0.8A/V (max) Supply Current Variation with VIN100mV Dropout at 500A Load CurrentLine Regulation: 160V/V (...

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SeekIC No. : 004411476 Detail

MAX6023: Features: 5-Bump UCSP Package (1.0mm ✕ 1.5mm ✕ 0.3mm)No Output Capacitor Needed±0.2% (max) Initial Accuracy30ppm/°C (max) Temperature Coefficient35A (max) Quiescent Supply Current0.8A/...

floor Price/Ceiling Price

Part Number:
MAX6023
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/27

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Product Details

Description



Features:

5-Bump UCSP Package (1.0mm ✕ 1.5mm ✕ 0.3mm)
No Output Capacitor Needed
±0.2% (max) Initial Accuracy
30ppm/°C (max) Temperature Coefficient
35A (max) Quiescent Supply Current
0.8A/V (max) Supply Current Variation with VIN
100mV Dropout at 500A Load Current
Line Regulation: 160V/V (max)
Output Voltage Options: 1.25V, 2.048V, 2.5V, 3.0V,4.096V, 4.5V, 5.0V



Application

Hand-Held Equipment
Data Acquisition Systems
Industrial and Process Control Systems
Battery-Operated Equipment
Hard-Disk Drives



Specifications

(Voltages Referenced to GND)
IN .........................................................................-0.3V to +13.5V
OUT ..............................................................-0.3V to (VIN + 0.3V)
Output Short Circuit to GND or IN (VIN < 6V) ..............Continuous
Output Short Circuit to GND or IN (VIN 6V) .........................60s
Continuous Power Dissipation (TA = +70°C)
    5-Bump UCSP (derate 3.4mW/°C above +70°C)........273mW
Operating Temperature Range ..........................-40°C to +85°C
Storage Temperature Range ...........................-65°C to +150°C
Bump Temperature (soldering, 10s)................................+300°C



Description

The MAX6023 is a family of low-dropout, micropower voltage references in a 5-bump, chip-scale package (UCSP™). The MAX6023 series-mode (three terminal) references, which operate with input voltages from 2.5V to 12.6V (1.25V and 2.048V options) or (VOUT + 0.2V) to 12.6V (all other voltage options), are available with output voltage options of 1.25V, 2.048V, 2.5V, 3.0V,4.096V, 4.5V, and 5.0V. These devices are guaranteed an initial accuracy of ±0.2% and 30ppm/°C temperature drift over the -40°C to +85°C extended temperature range.

The MAX6023 offer the benefit of moving to smaller footprint and lower profile devices, significantly smaller than even SC70 or SOT23 plastic surface-mount packages. The significantly lower profile (compared to plastic SMD packages) of the UCSP makes the MAX6023 ideal for height-critical applications. Miniature UCSP packages also enable device placement close to sources and allow more flexibility in a complex or large design layout.

The MAX6023 voltage references use only 27A of supply current. And unlike shunt-mode (two-terminal) references,the supply current of the MAX6023 family varies only 0.8A/V with supply-voltage changes, translating to longer battery life. Additionally, these internally compensated devices do not require an external compensation capacitor and are stable up to 2.2nF of load capacitance.The low-dropout voltage and the low supply current make these devices ideal for battery-operated systems.


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