Features: · 500Msps Output Update Rate
· Single 3.3V Supply Operation
· Excellent SFDR and IMD Performance
SFDR = 76dBc at fOUT = 30MHz (to Nyquist)
IMD = -85dBc at fOUT = 10MHz
ACLR = 70dB at fOUT = 61MHz
· 2mA to 20mA Full-Scale Output Current
· Differential, LVDS-Compatible Digital and Clock Inputs
· On-Chip 1.2V Bandgap Reference
· Low 130mW Power Dissipation
· 68-Pin QFN-EP PackageApplication·Base Stations: Single/Multicarrier UMTS,
·CDMA, GSM
·Communications: LMDS, MMDS, Point-to-Point
·Microwave
·Digital Signal Synthesis
·Automated Test Equipment (ATE)
·InstrumentationPinout
SpecificationsAVVDD, DVDD, VCLK to AGND........................................-0.3V to +3.9V
AVDD, DVDD, VCLK to DGND ........................................ -0.3V to +3.9V
AVDD, DVDD, VCLK to CLKGND .....................................-0.3V to +3.9V
AGND, CLKGND to DGND..............................................-0.3V to +0.3V
DACREF, REFIO, FSADJ to AGND.........................-0.3V to AVDD + 0.3V
IOUTP, IOUTN to AGND.........................................-1V to AVDD + 0.3V
CLKP, CLKN to CLKGND.....................................-0.3V to VCLK + 0.3V
B0P/B0NB11P/B11N, SEL0,
PD to DGND......................................................-0.3V to DVDD + 0.3V
Continuous Power Dissipation (TA = +70°C)
68-Pin QFN-EP (derate 41.7mW/°C above +70°C) ..........3333mW
Thermal Resistance (JA) .................................................+24°C/W
Operating Temperature Range ............................-40°C to +85°C
Junction Temperature ........................................................+150°C
Storage Temperature Range ..............................-60°C to +150°C
Lead Temperature (soldering, 10s) ....................................+300°C
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
DescriptionThe MAX5886 is an advanced, 12-bit, 500Msps digitalto-analog converter (DAC) designed to meet the demanding performance requirements of signal synthesis applications found in wireless base stations and other communications applications. Operating from a single 3.3V supply, this DAC offers exceptional dynamic performance such as 76dBc spurious-free dynamic range (SFDR) at fOUT = 30MHz. The DAC supports update rates of 500Msps and a power dissipation of only 230mW.
The MAX5886 utilizes a current-steering architecture, which supports a full-scale output current range of 2mA to 20mA, and allows a differential output voltage swing between 0.1VP-P and 1VP-P.
The MAX5886 features an integrated 1.2V bandgap reference and control amplifier to ensure high accuracy and low noise performance. Additionally, a separate reference input pin enables the user to apply an external reference source for optimum flexibility and to improve gain accuracy.
The digital and clock inputs of the MAX5886 are designed for differential low-voltage differential signal (LVDS)-compatible voltage levels. The MAX5886 is available in a 68-pin QFN package with an exposed paddle (EP) and is specified for the extended industrial temperature range (-40°C to +85°C).
Refer to the MAX5887 and MAX5888 data sheets for pin-compatible 14- and 16-bit versions of the MAX5886.
MAX5886 Data Sheet
