MAX5864

Features: · Integrated Dual 8-Bit ADCs and Dual 10-Bit DACs· Ultra-Low Power 42mW at fCLK = 22MHz (Transceiver Mode) 34mW at fCLK = 15.36MHz (Transceiver Mode) Low-Current Idle and Shutdown Modes· Excellent Dynamic Performance 48.5dB SINAD at fIN = 5.5MHz (ADC) 71.7dB SFDR at fOUT = 2.2MHz (DAC)· ...

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SeekIC No. : 004411385 Detail

MAX5864: Features: · Integrated Dual 8-Bit ADCs and Dual 10-Bit DACs· Ultra-Low Power 42mW at fCLK = 22MHz (Transceiver Mode) 34mW at fCLK = 15.36MHz (Transceiver Mode) Low-Current Idle and Shutdown Modes· E...

floor Price/Ceiling Price

Part Number:
MAX5864
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/27

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Product Details

Description



Features:

· Integrated Dual 8-Bit ADCs and Dual 10-Bit DACs
· Ultra-Low Power 42mW at fCLK = 22MHz (Transceiver Mode) 34mW at fCLK = 15.36MHz (Transceiver Mode) Low-Current Idle and Shutdown Modes
· Excellent Dynamic Performance 48.5dB SINAD at fIN = 5.5MHz (ADC) 71.7dB SFDR at fOUT = 2.2MHz (DAC)
· Excellent Gain/Phase Match ±0.1° Phase, ±0.03dB Gain at fIN = 5.5MHz (ADC)
· Internal/External Reference Option
· +1.8V to +3.3V Digital Output Level (TTL/CMOS Compatible)
· Multiplexed Parallel Digital Input/Output for ADCs/DACs
· Miniature 48-Pin Thin QFN Package (7mm × 7mm)
· Evaluation Kit Available (Order MAX5865EVKIT)



Application

·Narrowband/Wideband CDMA Handsets and PDAs
·Fixed/Mobile Broadband Wireless Modems
·3G Wireless Terminals



Specifications

VDD to GND, OVDD to OGND....................................-0.3V to +3.3V
GND to OGND..........................................................-0.3V to +0.3V
IA+, IA-, QA+, QA-, ID+, ID-, QD+, QD-, REFP, REFN,
REFIN, COM to GND......................................-0.3V to (VDD + 0.3V)
DD0DD9, SCLK, DIN, CS, CLK,
DA0DA7 to OGND ...................................-0.3V to (OVDD + 0.3V)
Continuous Power Dissipation (TA = +70°C)
48-Pin Thin QFN (derate 26.3mW/°C above +70°C) ..........2.1W
Thermal Resistance JA.................................................+38°C/W
Operating Temperature Range .........................-40°C to +85°C
Junction Temperature......................................................+150°C
Storage Temperature Range ...........................-60°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C



Description

The MAX5864 ultra-low-power, highly integrated analog front end is ideal for portable communication equipment such as handsets, PDAs, WLAN, and 3G wireless terminals.

The MAX5864 integrates dual 8-bit receive ADCs and dual 10-bit transmit DACs while providing the highest dynamic performance at ultra-low power. The ADCs' analog I-Q input amplifiers are fully differential and accept 1VP-P full-scale signals. Typical I-Q channel phase matching is ±0.1° and amplitude matching is ±0.03dB. The ADCs feature 48.5dB SINAD and 69dBc spurious-free dynamic range (SFDR) at fIN = 5.5MHz and fCLK = 22Msps. The DACs' analog I-Q outputs are fully differential with ±400mV full-scale output, and 1.4V common- mode level. Typical I-Q channel phase match is ±0.15° and amplitude match is ±0.05dB. The DACs also feature dual 10-bit resolution with 71.7dBc SFDR, and 57dB SNR at fOUT = 2.2MHz and fCLK = 22MHz.

The typical operating power is 42mW at fCLK = 22Msps with the ADCs and DACs operating simultaneously in transceiver mode. The MAX5864 features an internal 1.024V voltage reference that is stable over the entire operating power-supply range and temperature range. The MAX5864 operates on a +2.7V to +3.3V analog power supply and a +1.8V to +3.3V digital I/O power supply for logic compatibility. The quiescent current is 5.6mA in idle mode and 1µA in shutdown mode. The MAX5864 is specified for the extended (-40°C to +85°C) temperature range and is available in a 48-pin thin QFN package.




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