Features: ` 10-Bit, 165Msps Dual DAC
` Low Power190mW with IFS = 20mA at fCLK = 165MHz
` 2.7V to 3.6V Single Supply
` Full Output Swing and Dynamic Performance at 2.7V Supply
` Superior Dynamic Performance73dBc SFDR at fOUT = 40MHz UMTS ACLR = 65.5dB at fOUT = 30.7MHz
` Programmable Channel Gain Matching
` Integrated 1.24V Low-Noise Bandgap Reference
` Single-Resistor Gain Control
` Interleaved Data Mode
` Single-Ended and Differential Clock Input Modes
` Miniature 40-Pin Thin QFN Package, 6mm x 6mm
` EV Kit Available-MAX5854 EV KitApplicationApplications
Communications
SatCom, LMDS, MMDS, HFC, DSL, WLAN,
Point-to-Point Microwave Links
Wireless Base Stations
Quadrature Modulation
Direct Digital Synthesis (DDS)
Instrumentation/ATE
**Future product-contact factory for availability.Pinout
SpecificationsAVDD, DVDD, CVDD to AGND, DGND, CGND .........-0.3V to +4V
DA9DA0, DB9DB0, CW, DCE to AGND,
DGND, CGND .......................................................-0.3V to +4V
CLKXN, CLKXP to CGND........................................-0.3V to +4V
OUTP_, OUTN_ to AGND......................-1.25V to (AVDD + 0.3V)
CLK to DGND ........................................-0.3V to (DVDD + 0.3V)
REFR, REFO to AGND ............................-0.3V to (AVDD + 0.3V)
AGND to DGND, DGND to CGND,
AGND to CGND..................................................-0.3V to +0.3V
Maximum Current into Any Pin
(excluding power supplies) .........................................±50mA
Continuous Power Dissipation (TA = +70°C)
40-Pin Thin QFN-EP (derate 23.3mW/°C
above +70°C).............................................................1.860W
Operating Temperature Range .................... -40°C to +85°C
Storage Temperature Range ......................-65°C to +150°C
Junction Temperature............................................... ..+150°C
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
DescriptionThe MAX5851_1282605 dual, 10-bit, 165Msps digital-to-analog converter (DAC) provides superior dynamic performance in wideband communication systems. The MAX5851_1282605 inte- grates two 10-bit DAC cores, and a 1.24V reference. The MAX5854 supports single-ended and differential modes of operation. The dynamic performance is maintained over the entire 2.7V to 3.6V power-supply operating range. The analog outputs support a -1.0V to +1.25V compliance voltage.
The MAX5851_1282605 can operate in interleaved data mode to reduce the I/O pin count. This allows the converter to be updated on a single, 10-bit bus.
The MAX5851_1282605 features digital control of channel gain matching to within ±0.4dB in sixteen 0.05dB steps.Channel matching improves sideband suppression in analog quadrature modulation applications. The on- chip 1.24V bandgap reference includes a control amplifier that allows external full-scale adjustments of both channels through a single resistor. The internal ref-erence can be disabled and an external reference may be applied for high-accuracy applications.
The MAX5851_1282605 features full-scale current outputs of 2mA to 20mA and operates from a 2.7V to 3.6V single sup-ply. The DAC supports three modes of power-control operation: normal, low-power standby, and complete power-down. In power-down mode, the operating current is reduced to 1µA.
The MAX5851_1282605 is packaged in a 40-pin thin QFN with exposed paddle (EP) and is specified for the extended (-40°C to +85°C) temperature range.
Pin-compatible, lower speed, and lower resolution ver-sions are also available. Refer to the MAX5853 (10-bit,80Msps), the MAX5852** (8-bit, 165Msps), and the MAX5851_1282605 (8-bit, 80Msps) data sheets for more informa-tion. See Table 4 at the end of the data sheet.
MAX5851_1282605 Data Sheet
