Features: ·USB 1.1 and USB 2.0 (Full Speed) Signal- Switching Compliant·Data and Audio Signal Routing·Low-Capacitance (25pF) Data Switches·Less than 0.2ns Skew·-3dB Bandwidth: 325MHz·0.2Ω Channel-to-Channel Matching·0.8Ω On-Resistance Flatness·Rail-to-Rail Signal Handling·0.03% THD·+1....
MAX4760: Features: ·USB 1.1 and USB 2.0 (Full Speed) Signal- Switching Compliant·Data and Audio Signal Routing·Low-Capacitance (25pF) Data Switches·Less than 0.2ns Skew·-3dB Bandwidth: 325MHz·0.2Ω Chan...
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(All voltages referenced to GND.)
V+, IN_, EN ...................................................................-0.3V to +6V
COM_, NO_, NC_ (Note 1) ...............................-0.3V to (V+ + 0.3V)
Continuous Current
NO_, NC_, COM_ ...............................................................±100mA
Peak Current
(pulsed at 1ms, 10% duty cycle)........................................±200mA
(pulsed at 1ms, 50% duty cycle)....................................... ±300mA
Continuous Power Dissipation (TA = +70)
36-Bump UCSP (derate 15.3mW/ above +70).... .........1221mW
36-Pin Thin QFN (derate 26.3mW/ above +70)............ 2105mW
ESD per Method 3015.7...........................................................±2kV
Operating Temperature Range ..................................-40 to +85
Junction Temperature.............................................................+150
Storage Temperature Range ....................................-65 to +150
Lead Temperature (soldering, 10s) ...................................... +300
Bump Temperature (soldering)
Infrared (15s) ........................................................................+220
Vapor Phase (60s) .................................................................+215