Features: ·1.52mm × 1.52mm UCSP Package
·Guaranteed On-Resistance (RON) 25Ω (max) at +5V 50Ω (max) at +3V
·On-Resistance Matching 3Ω (max) at +5V 3.5Ω (max) at +3V
·Guaranteed <0.1nA Leakage Current at TA = +25°C
·Single-Supply Operation from +2.0V to +11V
·TTL/CMOS-Logic Compatible
·-108dB Crosstalk (1MHz)
·-72dB Off-Isolation (1MHz)
·Low Power Consumption: 0.5nW (typ)
·Rail-to-Rail Signal HandlingApplication·Battery-Powered Systems
·Audio/Video-Signal Routing
·Low-Voltage Data-Acquisition Systems
·Cell Phones
·Communications Circuits
·PDAsPinout
SpecificationsV+.........................................................................................-0.3V to +12V
IN_, COM_, NO_, NC_ (Note 1)....................................-0.3V to (V+ + 0.3V)
Continuous Current (any pin) ........................................................±10mA
Peak Current (any pin, pulsed at 1ms, 10% duty cycle) ................±20mA
Continuous Power Dissipation (TA = +70°C)
8-Pin µMAX (derate 4.5mW/°C above +70°C) ............................362mW
9-Bump UCSP (derate 4.7mW/°C above +70°C).........................379mW
Operating Temperature Range .....................................-40°C to +85°C
Storage Temperature Range ......................................-65°C to +150°C
Maximum Junction Temperature .................................................+150°C
Lead Temperature (soldering, 10s) ............................................+300°C
Bump Temperature (soldering, Note 2)
Infrared (15s) ............................................................................+220°C
Vapor Phase (60s) .....................................................................+215°C
Note 1: Signals on IN_, NO_, NC_, or COM_ exceeding V+ or GND are clamped by internal diodes. Limit forward-diode current to maximum current rating.
Note 2: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device can be exposed to during board level solder attach and rework. This limit permits only the use of the solder profiles recommended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and Convection reflow. Preheating is required. Hand or wave soldering is not allowed.
DescriptionThe MAX4731/MAX4732/MAX4733 low-voltage, dual, single-pole/single-throw (SPST) analog switches operate from a single +2V to +11V supply and handle Railto- Rail® analog signals. These switches exhibit low leakage current (0.1nA) and consume less than 0.5nW (typ) of quiescent power, making them ideal for batterypowered applications.
When powered from a +3V supply, the MAX4733 feature 50Ω (max) on-resistance (RON) with 3.5Ω (max) matching between channels, and 9Ω (max) flatness over the specified signal range.
The MAX4731 has two normally open (NO) switches, the MAX4732 has two normally closed (NC) switches, and the MAX4733 has one NO and one NC switch. Th MAX4731/MAX4732/MAX4733 are available in a 9-bump chip-scale package (UCSP™) and an 8-pin µMAX package. The tiny UCSP occupies a 1.52mm ×1.52mm area and significantly reduces the required PC board area.
MAX4733 Data Sheet
