MAX4368

Features: Drives 330mW into 32Ω(200mW into 16Ω)0.02% THD+N at 1kHz (120mW into 32Ω)Internal Bridged ConfigurationNo Output-Coupling Capacitors2.3V to 5.5V Single-Supply Operation2mA Supply CurrentLow-Power Shutdown ModeClickless Power-Up and ShutdownThermal Overload ProtectionAva...

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SeekIC No. : 004410550 Detail

MAX4368: Features: Drives 330mW into 32Ω(200mW into 16Ω)0.02% THD+N at 1kHz (120mW into 32Ω)Internal Bridged ConfigurationNo Output-Coupling Capacitors2.3V to 5.5V Single-Supply Operation2m...

floor Price/Ceiling Price

Part Number:
MAX4368
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/27

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Product Details

Description



Features:

Drives 330mW into 32Ω(200mW into 16Ω)
0.02% THD+N at 1kHz (120mW into 32Ω)
Internal Bridged Configuration
No Output-Coupling Capacitors
2.3V to 5.5V Single-Supply Operation
2mA Supply Current
Low-Power Shutdown Mode
Clickless Power-Up and Shutdown
Thermal Overload Protection
Available in SOT23, Thin QFN, µMAX, and UCSP
   Packages



Application

Cellular Phones
Two-Way Radios
PDAs
Headphones
Headsets
General-Purpose Audio



Pinout

  Connection Diagram


Specifications

VCC to GND..............................................................-0.3V to +6V
IN+, IN-, BIAS, SHDN...................................-0.3V to (VCC+ 0.3V)
Output Short Circuit to VCCor GND (Note 1).............Continuous
Output Short Circuit (OUT+ to OUT-) (Note 1)...........Continuous
Continuous Power Dissipation (TA= +70°C)
8-Bump UCSP (derate 4.7mW/°C above +70°C).............379mW
8-Pin SOT23 (derate 9.7mW/°C above +70°C)...............777mW
8-Pin µMAX (derate 4.5mW/°C above +70°C).................362mW
8-Pin Thin QFN (derate 24.4mW°C above +70°C).........1951mW

Operating Temperature Range...........................-40°C to +85°C
Junction Temperature.....................................................+150°C
Storage Temperature Range............................-65°C to +150°C
Lead Temperature (soldering, 10s).................................+300°C
Bump Temperature (soldering) (Note 2)
Infrared (15s)..................................................................+220°C
Vapor Phase (60s)...........................................................+215°C




Description

The MAX4366/MAX4367/MAX4368 are bridged audio power amplifiers intended for devices with internal speakers and headsets. The MAX4366/MAX4367/ MAX4368 are capable of delivering 330mW of continu- ous power into a 3Ω load, or 200mW into a 16 Ω load with 1% THD+N from a single 5V supply.

The MAX4366/MAX4367/MAX4368 bridged outputs elimi- nate the need for output-coupling capacitors minimizing external component count. The MAX4366/MAX4367/ MAX4368 also feature a low-power shutdown mode, clickless power-up/power-down and internal DC bias generation. The MAX4366 is a unity-gain stable, program- mable gain amplifier. The MAX4367/MAX4368 feature internally preset gains of 2V/V and 3V/V, respectively.

The MAX4368 is available in space-saving 8-pin SOT23, thin QFN and µMAX packages, and an 8-bump chip- scale package (UCSP™).




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