Features: `6 x 5 Chip-Scale Packaging (UCSP)`ESD Protection for RS-232 I/O Pins ±15kV-IEC 1000-4-2 Air-Gap Discharge ±8kV-IEC 1000-4-2 Contact Discharge ±15kV-Human Body Model`1µA Low-Power AutoShutdown`250kbps Guaranteed Data Rate`Meet EIA/TIA-232 Specifications Down to +3.1V`RS-232 Compati...
MAX3231E: Features: `6 x 5 Chip-Scale Packaging (UCSP)`ESD Protection for RS-232 I/O Pins ±15kV-IEC 1000-4-2 Air-Gap Discharge ±8kV-IEC 1000-4-2 Contact Discharge ±15kV-Human Body Model`1µA Low-Power Au...
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VCC to GND.............................................................-0.3V to +6.0V
V+ to GND ...............................................................-0.3V to +7.0V
V- to GND ................................................................+0.3V to -7.0V
V+ to |V-| (Note 1) ................................................................+13V
VL to GND................................................................-0.3V to +6.0V
Input Voltages
T_IN_, FORCEON, FORCEOFF to GND..............-0.3V to (VL + 0.3V)
R_IN_ to GND ......................................................................±25V
Output Voltages
T_OUT to GND ..................................................................±13.2V
R_OUT INVALID to GND .................................-0.3V to (VL + 0.3V)
INVALID to GND...........................................-0.3V to (VCC + 0.3V)
Short-Circuit Duration T_OUT to GND..........................Continuous
Continuous Power Dissipation (TA = +70)
6 ✕ 5 UCSP (derate 10.1mW/ above +70) ...............805mW
Operating Temperature Range ............................-40 to +85
Junction Temperature.......................................................+150
Storage Temperature Range .............................-65 to +150
Bump Temperature (soldering)
Infrared (15s) .................................................................+200
Vapor Phase (20s) ..........................................................+215