MAX3229

V_CC to GND...........................................................-0.3V to +6.0V
V+ to GND ............................................................-0.3V to +7.0V
V- to GND .............................................................+0.3V to -7.0V
V+ to |V-| (Note 1) ..............................................................+13V
VL to GND..............................................................-0.3V to +6.0V
Input Voltages
T_IN, FORCEON, FORCEOFF to GND..............-0.3V to (V_L + 0.3V)
R_IN to GND ......................................................................±25V
Output Voltages
T_OUT to GND ................................................................±13.2V
R_OUT to GND..............................................-0.3V to (V_L + 0.3V)
INVALID to GND.........................................-0.3V to (V_CC + 0.3V)
Short-Circuit Duration T_OUT to GND........................Continuous
Continuous Power Dissipation (T_A = +70°C)
6 × 5 UCSP (derate 10.1mW/°C above T_A = +70°C)...805mW
Operating Temperature Range .......................-40°C to +85°C
Junction Temperature...................................................+150°C
Storage Temperature Range ........................-65°C to +150°C
Bump Temperature (Soldering) (Note 2)
Infrared (15s) ...............................................................+200°C
Vapor Phase (20s) .......................................................+215°C
Note 1: V+ and V- can have maximum magnitudes of 7V, but their absolute difference cannot exceed 13V.
Note 2: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device
can be exposed to during board level solder attach and rework. This limit permits only the use of the solder profiles recommended
in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow. Preheating
is required. Hand or wave soldering is not allowed.

The MAX3228/MAX3229 are +2.5V to +5.5V powered EIA/TIA-232 and V.28/V.24 communications interfaces with low power requirements, and high data-rate capabilities, in a chip-scale package (UCSP™).

The MAX3228/MAX3229 achieve a 1µA supply current with Maxim's AutoShutdown™ feature. They save power without changes to existing BIOS or operating systems by entering low-power shutdown mode when the RS-232 cable is disconnected, or when the transmitters of the connected peripherals are off.

The transceivers have a proprietary low-dropout transmitter output stage, delivering RS-232 compliant performance from a +3.1V to +5.5V supply, and RS-232 compatible performance with a supply voltage as low as +2.5V. The dual charge pump requires only four small 0.1µF capacitors for operation from a +3.0V supply. Each device is guaranteed to run at data rates of 250kbps while maintaining RS-232 output levels.

The MAX3228/MAX3229 offer a separate power-supply input for the logic interface, allowing configurable logic levels on the receiver outputs and transmitter inputs. Operating over a +1.65V to VCC range, VL provides the MAX3228/MAX3229 compatibility with multiple logic families.

The MAX3229 contains one receiver and one transmitter. The MAX3228 contains two receivers and two transmitters. The MAX3228/MAX3229 are available in tiny chip-scale packaging and are specified across the extended industrial temperature range of -40°C to +85°C.