MAX1979

VDD to GND..............................................................-0.3V to +6V
SHDN, MAXV, MAXIP, MAXIN,
     CTLI, OT, UT to GND............................................-0.3V to +6V
FREQ, COMP, OS1, OS2, CS, REF, ITEC, AIN+, AIN-,
      AOUT, INT-, INTOUT, BFB+, BFB-, FB+, FB-,
      DIFOUT to GND....................................-0.3V to (VDD + 0.3V)
PVDD1, PVDD2 to VDD .........................................-0.3V to +0.3V
PVDD1, PVDD2 to GND...............................-0.3V to (VDD + 0.3V)
PGND1, PGND2 to GND .......................................-0.3V to +0.3V
COMP, REF, ITEC, OT, UT, INTOUT, DIFOUT,
      BFB-, BFB+, AOUT Short to GND .............................Indefinite
Peak LX Current (MAX1978) (Note 1).................................±4.5A
Peak LX Current (MAX1979) (Note 1)....................................+9A
Continuous Power Dissipation (TA = +70°C)
      48-Lead Thin QFN-EP
    (derate 26.3mW/°C above +70°C) (Note 2)..............2.105W
Operating Temperature Ranges
MAX1978ETM ..................................................-40°C to +85°C
MAX1979ETM ..................................................-40°C to +85°C
Maximum Junction Temperature ...................................+150°C
Storage Temperature Range ........................-65°C to +150°C
Lead Temperature (soldering, 10s) ..............................+300°C

Note 1: LX has internal clamp diodes to PGND and PVDD. Applications that forward bias these diodes should not exceed the IC's package power dissipation limits.
Note 2: Solder underside metal slug to PC board ground plane.

Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

The MAX1978/MAX1979 are the smallest, safest, most accurate complete single-chip temperature controllers for Peltier thermoelectric cooler (TEC) modules. On-chip power FETs and thermal control-loop circuitry minimize external components while maintaining high efficiency. Selectable 500kHz/1MHz switching frequency and a unique ripple-cancellation scheme optimize component size and efficiency while reducing noise. Switching speeds of internal MOSFETs are optimized to reduce noise and EMI. An ultralow-drift chopper amplifier maintains ±0.001°C temperature
stability. Output current, rather than voltage, is directly controlled to eliminate current surges. Individual heating and
cooling current and voltage limits provide the highest level of TEC protection.

The MAX1978/MAX1979 operates from a single supply and provides bipolar ±3A output by biasing the TEC between the outputs
of two synchronous buck regulators. True bipolar operation controls temperature without "dead zones" or other nonlinearities at low load currents. The control system does not hunt when the set point is very close to the natural operating point, where only a small amount of heating or cooling is needed. An analog control signal precisely sets the TEC current. The MAX1979 provides unipolar output up to 6A.

A MAX1978/MAX1979 chopper-stabilized instrumentation amplifier and a highprecision integrator amplifier are supplied to create a proportional-integral (PI) or proportional-integral-derivative (PID) controller. The instrumentation amplifier can interface to an external NTC or PTC thermistor, thermocouple, or semiconductor temperature sensor. Analog outputs are provided to monitor TEC temperature and current. In addition, separate overtemperature and undertemperature outputs indicate when the TEC temperature is out of range. An on-chip voltage reference provides bias for a thermistor bridge.

The MAX1978/MAX1979 are available in a low-profile 48-lead thin QFN-EP package and is specified over the -40°C to +85°C temperature range. The thermally enhanced QFN-EP package with exposed metal pad minimizes operating junction temperature. An evaluation kit is available to speed designs.