Features: ` Dual, 10-Bit, 45Msps Rx ADC and Dual, 10-Bit, 45Msps Tx DAC
` Ultra-Low Power
84.6mW at fCLK = 45MHz, Fast Mode
77.1mW at fCLK = 45MHz, Slow Mode
Low-Current Standby and Shutdown Modes
` Programmable Tx DAC Common-Mode DC Level and I/Q Offset Trim
` Excellent Dynamic Performance
SNR = 54.2dB at fIN = 5.5MHz (Rx ADC)
SFDR = 73.2dBc at fOUT = 2.2MHz (Tx DAC)
` Three 12-Bit, 1s Aux-DACs
` 10-Bit, 333ksps Aux-ADC with 4:1 Input Mux and Data Averaging
` Excellent Gain/Phase Match
±0.03° Phase, ±0.01dB Gain (Rx ADC) at fIN = 5.5MHz
` Multiplexed Parallel Digital I/O
` Serial-Interface Control
` Versatile Power-Control Circuits
Shutdown, Standby, Idle, Tx/Rx Disable
` Miniature 48-Pin Thin QFN Package (7mm x 7mm x 0.8mm)Application·WiMAX(SM) CPEs
·802.11a/b/g WLAN
·VoIP Terminals
·Portable Communication
·EquipmentPinout
SpecificationsVDD to GND, OVDD to OGND ...........................-0.3V to +3.6V
GND to OGND...................................................-0.3V to +0.3V
IAP, IAN, QAP, QAN, IDP, IDN, QDP,
QDN, DAC1, DAC2, DAC3 to GND..........................-0.3V to VDD
ADC1, ADC2 to GND...............................-0.3V to (VDD + 0.3V)
REFP, REFN, REFIN, COM to GND-0.3V to (VDD + 0.3V)D0D9,
DOUT, T/R, SHDN, SCLK, DIN, CS,
CLK to OGND ......................................-0.3V to (OVDD + 0.3V)
Continuous Power Dissipation (TA = +70°C)
48-Pin Thin QFN (derate 27.8mW/°C above +70°C) ..2.22W
Thermal Resistance JA .............................................36°C/W
Operating Temperature Range ....................-40°C to +85°C
Junction Temperature.................................................+150°C
Storage Temperature Range ......................-60°C to +150°C
Lead Temperature (soldering, 10s) ............................+300°C
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
DescriptionThe MAX19707 is an ultra-low-power, mixed-signal analog front-end (AFE) designed for power-sensitive communication equipment. Optimized for high dynamic performance at ultra-low power, the MAX19707device integrates a dual, 10-bit, 45Msps receive (Rx) ADC; dual, 10-bit, 45Msps transmit (Tx) DAC; three fast-settling 12-bit aux-DAC channels for ancillary RF front-end control; and a 10-bit, 333ksps housekeeping aux-ADC. The typical operating power in Tx-Rx FAST mode is 84.6mW at a 45MHz clock frequency.
The Rx ADCs of MAX19707 feature 54.2dB SNR and 71.2dBc SFDR at fIN = 5.5MHz and fCLK = 45MHz. The analog I/Q input amplifiers are fully differential and accept 1.024VP-P full-scale signals. Typical I/Q channel matching is ±0.03° phase and ±0.01dB gain.
The Tx DACs of MAX19707 feature 73.2dBc SFDR at fOUT = 2.2MHz and fCLK = 45MHz. The analog I/Q full-scale output voltage is ±400mV differential. The Tx DAC common-mode DC level is programmable from 0.71V to 1.05V. The I/Q channel offset is programmable to optimize radio lineup sideband/carrier suppresion. The typical I/Q channel matching is ±0.01dB gain and ±0.07° phase.
The Rx ADC and Tx DAC share a single, 10-bit parallel, high-speed digital bus allowing half-duplex operation for time-division duplex (TDD) applications. A 3-wire serial interface controls power-management modes, the aux-DAC channels, and the aux-ADC channels. The MAX19707 operates on a single +2.7V to +3.3V analog supply and +1.8V to +3.3V digital I/O supply. The MAX19707 is specified for the extended (-40°C to +85°C) temperature range and is available in a 48-pin, thin QFN package. The Selector Guide at the end of the data sheet lists other pin-compatible versions in this AFE family.
MAX19707 Data Sheet
