MAX15012

The MAX15012A/C and MAX15013A/C offer both noninverting drivers (see the Selector Guide). The MAX15012A/B/C/D feature CMOS (VDD/2)logic inputs. The MAX15013A/B/C/D feature TTL logic inputs. The MAX15012B/D and MAX15013B/D offer a noninverting high-side driver and an inverting low-side driver. The drivers are available in the industry-standard 8-pin SO footprint and pin configuration and a thermally enhanced 8-pin SO package. All devices operate over the -40°C to +125°C automotive temperature range. The high-voltage operation with very low and matched propagation delay between drivers, and high source/sink current capabilities make these devices suitable for the high-power, high-frequency telecom power converters. A reliable on-chip bootstrap diode connected between VDD and BST eliminates the need for an external discrete diode. The MAX15012/MAX15013 high-frequency, 175V halfbridge, n-channel MOSFET drivers drive highand lowside MOSFETs in high-voltage applications. These drivers are independently controlled and their 35ns typical propagation delay, from input to output, are matched to within 2ns (typ).

The features of MAX15012 can be summarized as (1)HIP2100/HIP2101 pin compatible (MAX15012A/C and MAX15013A/C); (2)up to 175V input operation; (3)8V to 12.6V VDD input voltage range; (4)2A peak source and sink current drive capability; (5)35ns typical propagation delay; (6)guaranteed 8ns propagation delay matching between drivers; (7)up to 500kHz switching frequency; (8)available in CMOS (VDD/2)or TTL logic-level inputs with hysteresis; (9)up to 14V logic inputs independent of input voltage; (10)low 2.5pf input capacitance; (11)low 70A supply current; (12)versions available with combination of noninverting and inverting drivers (MAX15012B/D and MAX15013B/D); (13)available in industry-standard 8-Pin SO and thermally enhanced SO packages.

The absolute maximum ratings of MAX15012 are (1)VDD, IN_H, IN_L:-0.3V to +14V; (2)DL: -0.3V to (VDD + 0.3V); (3)HS:-5V to +180V; (4)DH to HS: -0.3V to (VDD + 0.3V); (5)BST to HS: -0.3V to +14V; (6)dV/dt at HS: 50V/ns; (7)continuous power dissipation (TA = +70°C)8-Pin SO (derate 5.9mW/°C above +70°C): 470.6mW/ 8-Pin SO-EP (derate 19.2mW/°C above +70°C): 1538.5mW; (8)junction-to-case thermal resistance (JC)(Note 1)8-Pin SO: 40°C/W/ 8-Pin SO-EP:6°C/W; (9)junction-to-ambient thermal resistance (JA)(Note 1)8-Pin SO: 170°C/W/ 8-Pin SO-EP:52°C/W; (10)maximum junction temperature: +150°C; (11)operating temperature range: -40°C to +125°C; (12)storage temperature range: -65°C to +150°C; (13)lead temperature (soldering, 10s): +300°C.