DescriptionThe MAX14770E is designed to meet IEC 61158-2, TIA/EIA-422-B, TIA/EIA-485-A, V.11, and X.27 standards. The MAX14770E is a half-duplex, Q35kV high ESDprotected transceiver for PROFIBUS-DP and RS-485 applications. In addition, it can be used for RS-422/V.11 communications. The MAX14770E i...
MAX14770E: DescriptionThe MAX14770E is designed to meet IEC 61158-2, TIA/EIA-422-B, TIA/EIA-485-A, V.11, and X.27 standards. The MAX14770E is a half-duplex, Q35kV high ESDprotected transceiver for PROFIBUS-DP ...
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The MAX14770E is designed to meet IEC 61158-2, TIA/EIA-422-B, TIA/EIA-485-A, V.11, and X.27 standards. The MAX14770E is a half-duplex, Q35kV high ESDprotected transceiver for PROFIBUS-DP and RS-485 applications. In addition, it can be used for RS-422/V.11 communications. The MAX14770E is available in 8-pin SO and tiny TDFN (3mm x 3mm)packages, and is specified over the extended (-40°C to +85°C)and automotive (-40°C to +125°C)temperature ranges. It features a 1/4 standard-unit load receiver input impedance, allowing up to 128 1/4 unit load transceivers on the bus. Drivers are short-circuit current limited and are protected against excessive power dissipation by thermal-shutdown circuitry. It operates from a +5V supply and has true fail-safe circuitry that guarantees a logic-high receiver output when the receiver inputs are open or shorted.
The features of MAX14770E can be summarized as (1)meets EIA 61158-2 Type 3 PROFIBUS-DP; (2)+4.5V to +5.5V supply voltage; (3)20Mbps data rate; (4)short-circuit protected; (5)true fail-safe receiver; (6)thermal-shutdown protected; (7)hot swappable; (8)high ESD protection ±35kV human body model (HBM)/ ±20kV IEC 61000-4-2 Air Gap/ ±10kV IEC 61000-4-2 Contact; (9)-40°C to +125°C automotive temperature range in tiny 8-Pin (3mm x 3mm)TDFN.
The absolute maximum ratings of MAX14770E are (1)VCC: -0.3V to +6.0V; (2)RE, RO: -0.3V to (VCC + 0.3V); (3)DE, DI: -0.3V to +6.0V; (4)A, B: -8.0V to +13.0V; (5)short-circuit duration (RO, A, B)to GND: Continuous; (6)continuous power dissipation (TA = +70°C)8-Pin SOIC (derate 7.6mW/°C above +70°C): 606mW/ 8-Pin TDFN (derate 24.4mW/°C above +70°C): 1951mW; (7)junction-to-ambient thermal resistance (BJA)(Note 1)8-Pin SO: 132°C/W/ 8-Pin TDFN: 41°C/W; (8)junction-to-case thermal resistance (BJC)(Note 1)8-Pin SO: 38°C/W/ 8-Pin TDFN: 8°C/W; (9)operating temperature range: 8-Pin SO: -40°C to +85°C/ 8-Pin TDFN: -40°C to +125°C; (10)storage temperature range: -65°C to +150°C; (11)junction temperature range: -40°C to +150°C; (12)lead temperature (soldering, 10s): +300°C; (13)soldering temperature (reflow): 260°C.