MAX13046E

The MAX13046E/MAX13047E operate at a guaranteed data rate of 8Mbps when push- pull driving is used. The MAX13046E is available in a 6-pin DFN package, and the MAX13047E is available in a 10-pin UTQFN. Both devices are specified over the extended -40°C to +85°C operating temperature range and the MAX13046E/MAX13047E ±15kV ESD-protected bidirectional level translators provide level shifting for data transfer in a multivoltage system.The MAX13046E/MAX13047E feature a shutdown mode that reduces supply current to less than 1A thermal short-circuit protection, and ±15kV ESD protection on the VCC side for enhanced protection in applications that route signals externally. The MAX13046E is a single-channel translator, and the MAX13047E is a dual-channel translator. Externally applied voltages, VCC and VL, set the logic level on either side of the device. The MAX13046E/MAX13047E utilize a transmis- sion-gate-based design to allow data translation in either direction (VL-VCC) on any single data line. The MAX13046E/MAX13047E accept VL from +1.1V to the minimum of either +3.6V or (VCC + 0.3V), and VCC from +1.65V to +5.5V, making these devices ideal for data transfer between low-voltage ASICs/PLDs and higher voltage systems.

The features of MAX13046E can be summarized as (1)bidirectional level translation; (2)operation down to +1.1V on VL; (3)ultra-low supply current in shutdown mode 1A (max); (4)guaranteed push-pull driving data rate 8Mbps (+1.2V VL +3.6V, VCC +5.5V), 16Mbps (+1.8V VL VCC +3.3V); (5)extended ESD protection on the I/O VCC lines ±15kV human body model, ±15kV IEC61000-4-2 air-gap discharge method, ±8kV IEC61000-4-2 Contact discharge; (6)low supply current; (7)short-circuit protection; (8)space-saving DFN and UTQFN packages.

The absolute maximum ratings of MAX13046E are (1)VCC: -0.3V to +6V; (2)VL: -0.3V to +4V; (3)I/O VCC: -0.3V to (VCC + 0.3V); (4)I/O VL: -0.3V to (VL + 0.3V); (5)SHDN: -0.3V to +6V; (6)short-circuit duration I/O VL, I/O VCC to GND: continuous; (7)power dissipation (TA = +70°C) 6-Pin DFN (derate 2.1mW/°C above +70°C): 168mW, 10-Pin UTQFN (derate 6.9mW/°C above +70°C): 559mW; (8)junction-to-ambient thermal resistance (JA) (Note 1) 6-Pin DFN.477°C/W, 10-Pin UTQFN: 20.1°C/W; (9)junction-to-ambient thermal resistance (JC) (Note 1) 6-Pin DFN20.1°C/W, 10-Pin UTQFN: 143.1°C/W; (10)operating temperature range: -40°C to +85°C; (11)junction temperature: +150°C; (12)storage temperature range: -65°C to +150°C; (13)lead temperature (soldering, 10s): +300°C.