MA4SPS302

Features: · Surface Mount Diode· No Wirebonds Required· Rugged Silicon-Glass Construction· Silicon Nitride Passivation· Polymer Scratch Protection· Low Parasitic Capacitance and Inductance· High Power Handling (Efficient Heatsinking)ApplicationThese devices can be used in series and shunt switches...

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MA4SPS302 Picture
SeekIC No. : 004407905 Detail

MA4SPS302: Features: · Surface Mount Diode· No Wirebonds Required· Rugged Silicon-Glass Construction· Silicon Nitride Passivation· Polymer Scratch Protection· Low Parasitic Capacitance and Inductance· High Pow...

floor Price/Ceiling Price

Part Number:
MA4SPS302
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/27

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Product Details

Description



Features:

· Surface Mount Diode
· No Wirebonds Required
· Rugged Silicon-Glass Construction
· Silicon Nitride Passivation
· Polymer Scratch Protection
· Low Parasitic Capacitance and Inductance
· High Power Handling (Efficient Heatsinking)



Application

These devices can be used in series and shunt switches for wireless circuits where smaller area and profile are required. Low parasitic values of L and C make additional circuit tuning unnecessary. 2 RS value @ 1 mA makes the devices suitable for smaller current consumption applications. W




Specifications

Parameter Absolute Maximum
Reverse Voltage
Forward Current
Operating Temperature
Storage Temperature
Mounting Temperature
-70 V
100 mA
-65°C to +150°C
-65°C to +150°C
+235°C for 10 seconds
1. Exceeding these limits may cause permanent damage.


Description

M/A-COM's MA4SPS302 is a silicon-glass PIN diode fabricated with M/A-COM's patented HMIC™ process. This device features two silicon pedestals embedded in a low loss glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal side walls conductive. Selective backside metalization is applied producing a surface mount device. The topside is fully encapsulated with silicon nitride and has an additional polymer layer for scratch protection. These protective coatings prevent damage to the junction and the anode air-bridge during handling and assembly.




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