M5M5Y816WG -70HI

Features: · Single 1.65~2.3V power supply· Small stand-by current: 0.5µA (2.0V, ty p.)· No clocks, No ref resh· Data retention supply v oltage =1.3V· All inputs and outputs are TTL compatible.· Easy memory expansion by S1, S2,BC1 and BC2· Common Data I/O· Three-state outputs: OR-tie capabili...

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M5M5Y816WG -70HI Picture
SeekIC No. : 004406375 Detail

M5M5Y816WG -70HI: Features: · Single 1.65~2.3V power supply· Small stand-by current: 0.5µA (2.0V, ty p.)· No clocks, No ref resh· Data retention supply v oltage =1.3V· All inputs and outputs are TTL compatible....

floor Price/Ceiling Price

Part Number:
M5M5Y816WG -70HI
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/27

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Product Details

Description



Features:

· Single  1.65~2.3V  power  supply
· Small stand-by current: 0.5µA (2.0V, ty p.)
· No  clocks, No  ref resh
· Data  retention supply v oltage =1.3V
· All  inputs  and  outputs are  TTL  compatible.
· Easy memory expansion by S1, S2, BC1 and BC2
· Common  Data  I/O
· Three-state  outputs: OR-tie  capability
· OE  prev ents  data  contention  in  the  I/O  bus
· Process technology: 0.18µm CMOS
· Package:  48ball  7.5mm x 8.5mm  CSP



Specifications

Symbol
Parameter
Conditions
Ratings
Units
Vcc
Supply v oltage
With respect to GND
-0.5* ~ +2.7
V
VI
Input v oltage
With respect to GND
-0.2* ~ Vcc + 0.2 (max. 2.7V)
VO
Output v oltage
With respect to GND
0 ~ Vcc
Pd
Power dissipation
Ta=25
700
mW
Ta
Operating
temperature
I-v ersion
- 40 ~ +85
Tstg
Storage temperature
- 65 ~ +150
* -0.7V in case of AC (Pulse width 30ns)



Description

The M5M5Y816 is a f amily of low v oltage 8-Mbit static RAMs organized as 524288-words by 16-bit,  f abricated by  Mitsubishi's high-perf ormance 0.18µm CMOS technology.

The M5M5Y816 is suitable f or memory applications where a simple interf acing , battery operating and battery backup are the important design objectiv es.

M5M5Y816WG is packaged in a  CSP (chip scale package), with the outline of 7.5mm x 8.5mm,  ball matrix of 6 x 8 (48ball) and ball pitch of 0.75mm.  It giv es the best solution f or a compaction

of mounting area as well as f lexibility of wiring pattern of printed circuit boards.




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