M5M5Y416CWG -85HI

Features: - Single 1.65~2.3V power supply- Small stand-by current: 0.2µA (2.0V, ty p.)- No clocks, No ref resh- Data retention supply v oltage =1.5V- All inputs and outputs are TTL compatible.- Easy memory expansion by S1, S2,BC1 and BC2- Common Data I/O- Three-state outputs: OR-tie capabili...

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M5M5Y416CWG -85HI Picture
SeekIC No. : 004406368 Detail

M5M5Y416CWG -85HI: Features: - Single 1.65~2.3V power supply- Small stand-by current: 0.2µA (2.0V, ty p.)- No clocks, No ref resh- Data retention supply v oltage =1.5V- All inputs and outputs are TTL compatible....

floor Price/Ceiling Price

Part Number:
M5M5Y416CWG -85HI
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/27

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Product Details

Description



Features:

- Single 1.65~2.3V power supply
- Small stand-by current: 0.2µA (2.0V, ty p.)
- No clocks, No ref resh
- Data retention supply v oltage =1.5V
- All inputs and outputs are TTL compatible.
- Easy memory expansion by S1, S2BC1 and BC2
- Common Data I/O
- Three-state outputs: OR-tie capability
- OE prev ents data contention in the I/O bus
- Process technology : 0.18µm CMOS
- Package: 48ball 7.0mm x 8.5mm CSP



Specifications

Symbol Parameter Conditions
Ratings
Units
VCC Supply v oltage With respect to GND
-0.5* ~ +2.7
V
VI Input v oltage With respect to GND
-0.2* ~ Vcc + 0.2(max. 2.7V)
VO Output v oltage With respect to GND
0 ~ Vcc
Pd Power dissipation Ta=25°C
700
mW
Ta Operating temperature I-v ersion
- 40 ~ +85
Tstg Storage temperature  
- 65 ~ +150
* -0.7V in case of AC (Pulse width 30ns)


Description

The M5M5Y416C is a f amily of low v oltage 4-Mbit static RAMs organized as 262144-words by 16-bit, f abricated by Mitsubishi's high-perf ormance 0.18µm CMOS technology .

The M5M5Y416C is suitable f or memory applications where a simple interf acing , battery operating and battery backup are the important design objectiv es.

M5M5Y416CWG is packaged in a CSP (chip scale package), with the outline of 7.0mm x 8.5mm, ball matrix of 6 x 8 (48ball) and ball pitch of 0.75mm. It giv es the best solution f or a compaction of mounting area as well as f lexibility of wiring pattern of printed circuit boards.




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