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M5M5Y416CWG -70HI

Features: ·Single 1.65~2.3V power supply·Small stand-by current: 0.2µA (2.0V, ty p.)·No clocks, No ref resh·Data retention supply v oltage =1.3V·All inputs and outputs are TTL compatible.·Easy memory expansion by S1, S2,BC1 and BC2·Common Data I/O·Three-state outputs: OR-tie capability·OE pr...

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M5M5Y416CWG -70HI: Features: ·Single 1.65~2.3V power supply·Small stand-by current: 0.2µA (2.0V, ty p.)·No clocks, No ref resh·Data retention supply v oltage =1.3V·All inputs and outputs are TTL compatible.·Easy...

M5M5Y416CWG -70HI Data Sheet

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Part Number:
M5M5Y416CWG -70HI
Supply Ability:
5000

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  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/27

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Product Details

Description



Features:

·Single 1.65~2.3V power supply
·Small stand-by current: 0.2µA (2.0V, ty p.)
·No clocks, No ref resh
·Data retention supply v oltage =1.3V
·All inputs and outputs are TTL compatible.
·Easy memory expansion by S1, S2, BC1 and BC2
·Common Data I/O
·Three-state outputs: OR-tie capability
·OE prev ents data contention in the I/O bus
·Process technology : 0.18µm CMOS
·Package: 48ball 7.0mm x 8.5mm CSP


Specifications

Symbol Parameter Conditions Ratings Units
Vcc Supply v oltage With respect to GND -0.5* ~ +2.7 V
VI Input v oltage With respect to GND -0.2* ~ Vcc + 0.2 (max. 2.7V)
VO Output v oltage With respect to GND 0 ~ Vcc
PD Power dissipation Ta=25°C 700 mW
Ta Operating
temperature		 I-v ersion - 40 ~ +85 °C
Tstg Storage temperature   - 65 ~ +150 °C



Description

The M5M5Y416C is a f amily of low v oltage 4-Mbit static RAMs organized as 262144-words by 16-bit, f abricated by Mitsubishi's high-perf ormance 0.18µm CMOS technology .

The M5M5Y416C is suitable f or memory applications where a simple interf acing , battery operating and battery backup are the important design objectiv es. M5M5Y416CWG is packaged in a CSP (chip scale package), with the outline of 7.0mm x 8.5mm, ball matrix of 6 x 8 (48ball) and ball pitch of 0.75mm. It giv es the best solution f or a compaction of mounting area as well as f lexibility of wiring pattern of printed circuit boards.




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