M5M5W416CWG-85HI

Features: `Single 1.65~2.3V power supply`Small stand-by current: 0.2A (2.0V, ty p.)`No clocks, No ref resh`Data retention supply v oltage =1.5V`All inputs and outputs are TTL compatible.`Easy memory expansion by S1, S2, BC1 and BC2`Common Data I/O`Three-state outputs: OR-tie capability`OE prev ent...

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M5M5W416CWG-85HI Picture
SeekIC No. : 004406355 Detail

M5M5W416CWG-85HI: Features: `Single 1.65~2.3V power supply`Small stand-by current: 0.2A (2.0V, ty p.)`No clocks, No ref resh`Data retention supply v oltage =1.5V`All inputs and outputs are TTL compatible.`Easy memory...

floor Price/Ceiling Price

Part Number:
M5M5W416CWG-85HI
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/27

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Product Details

Description



Features:

`Single 1.65~2.3V power supply
`Small stand-by current: 0.2A (2.0V, ty p.)
`No clocks, No ref resh
`Data retention supply v oltage =1.5V
`All inputs and outputs are TTL compatible.
`Easy memory expansion by S1, S2, BC1 and BC2
`Common Data I/O
`Three-state outputs: OR-tie capability
`OE prev ents data contention in the I/O bus
`Process technology: 0.18m CMOS
`Package: 48ball 7.0mm x 8.5mm CSP



Specifications

Symbol Parameter Conditions
Ratings
Units
VCC Supply v oltage With respect to GND
-0.5* ~ +2.7
V
VI Input v oltage With respect to GND
-0.2* ~ Vcc + 0.2(max. 2.7V)
VO Output v oltage With respect to GND
0 ~ Vcc
Pd Power dissipation Ta=25°C
700
mW
Ta Operating temperature I-v ersion
- 40 ~ +85
Tstg Storage temperature  
- 65 ~ +150
* -0.7V in case of AC (Pulse width 30ns)


Description

The M5M5W416C is a f amily of low v oltage 4-Mbit static RAMs organized as 262144-words by 16-bit, f abricated by Mitsubishi's high-perf ormance 0.18m CMOS technology .

The M5M5W416C is suitable f or memory applications where a simple interf acing , battery operating and battery backup are the important design objectiv es.

M5M5W416CWG is packaged in a CSP (chip scale package), with the outline of 7.0mm x 8.5mm, ball matrix of 6 x 8 (48ball) and ball pitch of 0.75mm. It giv es the best solution f or a compaction of mounting area as well as f lexibility of wiring pattern of printed circuit boards.




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