M5M5V416CWG-70HI

Features: ` Single 2.7~3.0V power supply` Small stand- by current: 0.1A (2.85V, ty p.)` No clocks, No ref resh` Data retention supply v oltage =2.0V` All inputs and outputs are TTL compatible.` Easy memory expansion by S1, S2, BC1 and BC2` Common Data I/O` Three- state outputs: OR- tie cap...

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M5M5V416CWG-70HI Picture
SeekIC No. : 004406345 Detail

M5M5V416CWG-70HI: Features: ` Single 2.7~3.0V power supply` Small stand- by current: 0.1A (2.85V, ty p.)` No clocks, No ref resh` Data retention supply v oltage =2.0V` All inputs and outputs are TTL compatible.`...

floor Price/Ceiling Price

Part Number:
M5M5V416CWG-70HI
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/27

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Product Details

Description



Features:

` Single 2.7~3.0V power supply
` Small stand- by current: 0.1A (2.85V, ty p.)
` No clocks, No ref resh
` Data retention supply v oltage =2.0V
` All inputs and outputs are TTL compatible.
` Easy memory expansion by S1, S2, BC1 and BC2
` Common Data I/O
` Three- state outputs: OR- tie capability
` OE prev ents data contention in the I/O bus
` Process technology: 0.18m CMOS
` Package: 48ball 7.0mm x 8.5mm CSP



Specifications

Symbol Parameter Conditions Ratings Units
VCC Supply v oltage With respect to GND -0.5* ~ +3.6 V
VI Input v oltage With respect to GND -0.2* ~ Vcc + 0.2
VO Output v oltage With respect to GND 0 ~ Vcc
Pd Power dissipation Ta=25°C 700 mW
Ta Operating temperature I-v ersion - 40 ~ +85
Tstg Storage temperature   - 65 ~ +150
* -3.0V in case of AC (Pulse width 30ns)


Description

The M5M5V416C is a f amily of low v oltage 4-Mbit static RAMs organized as 262144-words by 16-bit, f abricated by Mitsubishi's high-perf ormance 0.18m CMOS technology .

The M5M5V416C is suitable f or memory applications where a simple interf acing , battery operating and battery backup are the important design objectiv es.

M5M5V416CWG is packaged in a CSP (chip scale package), with the outline of 7.0mm x 8.5mm, ball matrix of 6 x 8 (48ball) and ball pitch of 0.75mm. It giv es the best solution f or a compaction of mounting area as well as f lexibility of wiring pattern of printed circuit boards.




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