M5M5V416BUG-70HI

Features: Single +2.7~+3.6V power supplySmall stand-by current: 0.3A(3V,ty p.)No clocks, No ref reshData retention supply v oltage =2.0V to 3.6VAll inputs and outputs are TTL compatible.Easy memory expansion by S1 , S2, BC1 and BC2 Common Data I/OThree-state outputs: OR-tie capabilityOE prev ents ...

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SeekIC No. : 004406343 Detail

M5M5V416BUG-70HI: Features: Single +2.7~+3.6V power supplySmall stand-by current: 0.3A(3V,ty p.)No clocks, No ref reshData retention supply v oltage =2.0V to 3.6VAll inputs and outputs are TTL compatible.Easy memory ...

floor Price/Ceiling Price

Part Number:
M5M5V416BUG-70HI
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/27

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Product Details

Description



Features:

Single +2.7~+3.6V power supply
Small stand-by current: 0.3A(3V,ty p.)
No clocks, No ref resh
Data retention supply v oltage =2.0V to 3.6V
All inputs and outputs are TTL compatible.
Easy memory expansion by S1 , S2, BC1 and BC2
Common Data I/O
Three-state outputs: OR-tie capability
OE prev ents data contention in the I/O bus
Process technology: 0.25m CMOS
Package: 48pin 7mm x 8.5mm CSP



Specifications

Symbol
Parameter
Conditions
Ratings
Units
VCC
Supply v oltage
With respect to GND
-0.5* ~ +4.6
V
VI
Input v oltage
With respect to GND
-0.5* ~ Vcc + 0.5
VO
Output v oltage
With respect to GND
0 ~ Vcc
Pd
Power dissipation
Ta=25°C
700
mW
Ta
Operating
temperature
I-v ersion
- 40 ~ +85
°C
Tstg
Storage temperature
- 65 ~ +150
°C

                                                                        * -3.0V in case of AC (Pulse width 30ns)


Description

The M5M5V416B is a f amily of low v oltage 4-Mbit static RAMs organized as 262,144-words by 16-bit, f abricated by Mitsubishi's high-perf ormance 0.25m CMOS technology .

The M5M5V416B is suitable f or memory applications where a simple interf acing , battery operating and battery backup are the important design objectives.

M5M5V416BUG is packaged in a CSP (chip scale package), with the outline of 7mm x 8.5mm, ball matrix of 6 x 8 (48pin) and ball pitch of 0.75mm. It giv es the best solution f or a compaction of mounting area as well as f lexibility of wiring pattern of printed circuit boards.

Those are summarized in the part name table below. 




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